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Surface-mount capacitor A MOSFET, placed upon a British postage stamp for size comparison. Surface-mount technology (SMT), originally called planar mounting, [1] is a method in which the electrical components are mounted directly onto the surface of a printed circuit board (PCB). [2]
Chip-size package (CSP) developed by National Semiconductor [21] COB: Chip on board: Bare die supplied without a package. It is mounted directly to the PCB using bonding wires and covered with a blob of black Epoxy. [22] Also used for LEDs. In LEDs, transparent epoxy or a silicon caulk-like material that may contain a phosphor is poured into a ...
IEC/EN 60384-20—Fixed metallized polyphenylene sulfide film dielectric surface mount d.c. capacitors; IEC/EN 60384-23—Fixed metallized polyethylene naphthalate film dielectric chip d.c. capacitors; Electrolytic capacitors. IEC/EN 60384-3—Surface mount fixed tantalum electrolytic capacitors with manganese dioxide solid electrolyte
The minimum thickness of the dielectric layer, which today (2013) for low voltage capacitors is in the size range of 0.5 micrometers [3] is limited downwards by the grain size of the ceramic powder. The thickness of the dielectric for capacitors with higher voltages is determined by the dielectric strength of the desired capacitor.
Tantalum electrolytic capacitors, usually used in the SMD (surface-mount device) version, have a higher specific capacitance than the aluminium electrolytic capacitors and are used in devices with limited space or flat design such as laptops. They are also used in military technology, mostly in axial style, hermetically sealed.
Surface mount components avoid undesirable high-frequency effects due to the leads and simplify automated assembly, although manual handling is made difficult due to their small size. Mechanically controlled variable capacitors allow the plate spacing to be adjusted, for example by rotating or sliding a set of movable plates into alignment with ...
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