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The hard disk space offered was a 32 GB—high for the time. [ 2 ] Further minor refinements were made to the T2X series resulting in the T22 and finally in 2002 with the T23 a Pentium III-M 1.13 GHz "Tualatin" having 128 MiB of RAM and a 30 GB hard drive.
DDR5 octuples the maximum DIMM capacity from 64 GB to 512 GB. [8] [3] DDR5 also has higher frequencies than DDR4, up to 8GT/s which translates into 64 GB/s (8 gigatransfers/second × 64-bits/module / 8 bits/byte = 64 GB/s) of bandwidth per DIMM. Rambus announced a working DDR5 dual in-line memory module (DIMM) in September 2017.
The individual chips making up a 1 GB memory module are usually organized as 2 26 8-bit words, commonly expressed as 64M×8. Memory manufactured in this way is low-density RAM and is usually compatible with any motherboard specifying PC3200 DDR-400 memory. [18] [citation needed]
Compression Attached Memory Module (CAMM) is a memory module form factor which uses a land grid array, and developed at Dell by engineer Tom Schnell as a replacement for DIMMs and SO-DIMMs which use edge connectors and had been in use for about 25 years. [1] The first SO-DIMMs were introduced by JEDEC in 1997. [2] [3] [4] [5]
The Toshiba T1100 is a laptop manufactured by Toshiba in 1985, and has subsequently been described by Toshiba as "the world's first mass-market laptop computer". [1] Its technical specifications were comparable to the original IBM PC desktop, using floppy disks (it had no hard drive), a 4.77 MHz Intel 80C88 CPU (a lower-power variation of the Intel 8088), 256 KB of conventional RAM extendable ...
DDR5 with ECC support This article is part of the CPU socket series LGA 4677 ( Socket E ) is a zero insertion force flip-chip land grid array (LGA) CPU socket designed by Intel , compatible with Sapphire Rapids server and workstation processors, which was released in January 2023.
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