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  2. Heat sink - Wikipedia

    en.wikipedia.org/wiki/Heat_sink

    The heat sink thermal resistance model consists of two resistances, namely the resistance in the heat sink base, , and the resistance in the fins, . The heat sink base thermal resistance, , can be written as follows if the source is a uniformly applied the heat sink base. If it is not, then the base resistance is primarily spreading resistance:

  3. Sink (computing) - Wikipedia

    en.wikipedia.org/wiki/Sink_(computing)

    In computing, a sink, or data sink generally refers to the destination of data flow.. The word sink has multiple uses in computing. In software engineering, an event sink is a class or function that receives events from another object or function, while a sink can also refer to a node of a directed acyclic graph with no additional nodes leading out from it, among other uses.

  4. Computer cooling - Wikipedia

    en.wikipedia.org/wiki/Computer_cooling

    Computer cooling is required to remove the waste heat produced by computer components, to keep components within permissible operating temperature limits. Components that are susceptible to temporary malfunction or permanent failure if overheated include integrated circuits such as central processing units (CPUs), chipsets , graphics cards ...

  5. Thermal management (electronics) - Wikipedia

    en.wikipedia.org/wiki/Thermal_management...

    Generally, forced convection heat sink thermal performance is improved by increasing the thermal conductivity of the heat sink materials, increasing the surface area (usually by adding extended surfaces, such as fins or foam metal) and by increasing the overall area heat transfer coefficient (usually by increase fluid velocity, such as adding ...

  6. Thermal interface material - Wikipedia

    en.wikipedia.org/wiki/Thermal_interface_material

    A thermal interface material (shortened to TIM) is any material that is inserted between two components in order to enhance the thermal coupling between them [1].A common use is heat dissipation, in which the TIM is inserted between a heat-producing device (e.g. an integrated circuit) and a heat-dissipating device (e.g. a heat sink).

  7. Talk:Heat sink - Wikipedia

    en.wikipedia.org/wiki/Talk:Heat_sink

    This is not genuinely a heat sink, it is a heat store. The definition of heat sink implies that there is only one direction of heat flow. Heat goes in from the fuel, but the metal is acting as a heat source as the heat goes out to the food. This is similar to the old-fashioned cooking pots with thick copper bottoms.

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    mail.aol.com/?icid=aol.com-nav

    Get AOL Mail for FREE! Manage your email like never before with travel, photo & document views. Personalize your inbox with themes & tabs. You've Got Mail!

  9. Circulation problem - Wikipedia

    en.wikipedia.org/wiki/Circulation_problem

    The circulation problem and its variants are a generalisation of network flow problems, with the added constraint of a lower bound on edge flows, and with flow conservation also being required for the source and sink (i.e. there are no special nodes). In variants of the problem, there are multiple commodities flowing through the network, and a ...