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Cathodic arc deposition or Arc-PVD is a physical vapor deposition technique in which an electric arc is used to vaporize material from a cathode target. The vaporized material then condenses on a substrate, forming a thin film. The technique can be used to deposit metallic, ceramic, and composite films.
Cathodic arc deposition: a high-power electric arc discharged at the target (source) material blasts away some into highly ionized vapor to be deposited onto the workpiece. Electron-beam physical vapor deposition : the material to be deposited is heated to a high vapor pressure by electron bombardment in "high" vacuum and is transported by ...
thermal evaporation; sputtering; cathodic arc vaporization; laser ablation; decomposition of a chemical vapor precursor, chemical vapor deposition; In reactive deposition, the depositing material reacts either with a component of the gaseous environment (Ti + N → TiN) or with a co-depositing species (Ti + C → TiC).
Cathodic arc deposition; E. Evaporation (deposition) H. High-power impulse magnetron sputtering; I. Ion beam-assisted deposition; Ion plating; M.
The coatings are mostly deposited by cathodic arc deposition or magnetron sputtering. Even though most TiAlN and AlTiN coatings are industrially synthesized using alloy targets with specific percentages of aluminium and titanium it is possible to produce TiAlN coatings with pure Al and Ti targets using a cathodic arc deposition technique.
The thermionic vacuum arc (TVA) is a new type of plasma source, which generates a plasma containing ions with a directed energy. TVA discharges can be ignited in high-vacuum conditions between a heated cathode (electron gun) and an anode (tungsten crucible) containing the material.
Cathodic arc deposition; ... Vacuum evaporation; W. Wake Shield Facility; Wetting layer This page was last edited on 10 November 2020, at 11:55 ...
Electron beams can be generated by thermionic emission, field electron emission or the anodic arc method. The generated electron beam is accelerated to a high kinetic energy and directed towards the evaporation material. Upon striking the evaporation material, the electrons will lose their energy very rapidly. [3]