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  2. Wafer (electronics) - Wikipedia

    en.wikipedia.org/wiki/Wafer_(electronics)

    Bottom right: completed solar wafers. In electronics, a wafer (also called a slice or substrate) [1] is a thin slice of semiconductor, such as a crystalline silicon (c-Si, silicium), used for the fabrication of integrated circuits and, in photovoltaics, to manufacture solar cells. The wafer serves as the substrate for microelectronic devices ...

  3. Smart cut - Wikipedia

    en.wikipedia.org/wiki/Smart_cut

    Smart cut is a technological process that enables the transfer of very fine layers of crystalline silicon material onto a mechanical support. It was invented by Michel Bruel of CEA-Leti, and was protected by US patent 5374564. [1] The application of this technological procedure is mainly in the production of silicon-on-insulator (SOI) wafer ...

  4. Soitec - Wikipedia

    en.wikipedia.org/wiki/Soitec

    Soitec was founded in 1992 near Grenoble in France by two researchers from CEA Leti, an institute for micro- and nanotechnologies research created by the French Commission for Atomic Energy and Alternative Energies (CEA). The pair developed Smart Cut ™ technology to industrialize Silicon-On-Insulator (SOI) wafers, and built their first ...

  5. Die singulation - Wikipedia

    en.wikipedia.org/wiki/Die_singulation

    Die singulation, also called wafer dicing, is the process in semiconductor device fabrication by which dies are separated from a finished wafer of semiconductor. [1] Die singulation comes after the photolithography process. It can involve scribing and breaking, mechanical sawing (normally with a machine called a dicing saw) [2] or laser cutting.

  6. Die preparation - Wikipedia

    en.wikipedia.org/wiki/Die_preparation

    Die preparation. Wafer glued on blue tape and cut into pieces, with some individual dies removed. Die preparation is a step of semiconductor device fabrication during which a wafer is prepared for IC packaging and IC testing. The process of die preparation typically consists of two steps: wafer mounting and wafer dicing.

  7. Mr Creosote - Wikipedia

    en.wikipedia.org/wiki/Mr_Creosote

    Mr Creosote. Mr. Creosote is a fictional character who appears in Monty Python's The Meaning of Life. He is a monstrously obese and vulgar restaurant patron who is served a vast amount of food and alcohol whilst vomiting repeatedly. After being persuaded to eat an after-dinner mint – "It's only wafer-thin" – he graphically explodes.

  8. Gallium arsenide - Wikipedia

    en.wikipedia.org/wiki/Gallium_arsenide

    Gallium arsenide is an important semiconductor material for high-cost, high-efficiency solar cells and is used for single-crystalline thin-film solar cells and for multi-junction solar cells. [35] The first known operational use of GaAs solar cells in space was for the Venera 3 mission, launched in 1965.

  9. Die (integrated circuit) - Wikipedia

    en.wikipedia.org/wiki/Die_(integrated_circuit)

    Die (integrated circuit) A die, in the context of integrated circuits, is a small block of semiconducting material on which a given functional circuit is fabricated. Typically, integrated circuits are produced in large batches on a single wafer of electronic-grade silicon (EGS) or other semiconductor (such as GaAs) through processes such as ...