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  2. Direct bonding - Wikipedia

    en.wikipedia.org/wiki/Direct_bonding

    The procedural steps of the direct bonding process of wafers any surface is divided into wafer preprocessing, pre-bonding at room temperature and; annealing at elevated temperatures. Even though direct bonding as a wafer bonding technique is able to process nearly all materials, silicon is the most established material up to now. Therefore, the ...

  3. Typology of business strategies - Wikipedia

    en.wikipedia.org/.../Typology_of_business_strategies

    This is the least effective of the four strategies. It is without direction or focus. Miles, Snow et al. (1978) have identified three reasons why organizations become reactors: Top management may not have clearly articulated the organization's strategy. Management does not fully shape the organization's structure and processes to fit a chosen ...

  4. Delta model - Wikipedia

    en.wikipedia.org/wiki/Delta_model

    The delta model can be illustrated using the strategic triangle (see fig.1). There are three points: system lock-in, best customer solutions and best product. [8] System lock- in enables market dominance and can achieve complementor share, it focuses on the entire system economics and instead of product-centered economics, which makes it very sustainable. [9]

  5. Plasma-activated bonding - Wikipedia

    en.wikipedia.org/wiki/Plasma-activated_bonding

    Plasma-activated bonding is a derivative, directed to lower processing temperatures for direct bonding with hydrophilic surfaces. The main requirements for lowering temperatures of direct bonding are the use of materials melting at low temperatures and with different coefficients of thermal expansion (CTE) .

  6. Thermocompression bonding - Wikipedia

    en.wikipedia.org/wiki/Thermocompression_bonding

    2. Typically, thermocompression bonds are made with delivering heat and pressure to the mating surface by a hard faced bonding tool. Compliant bonding [11] is a unique method of forming this type of solid state bond between a gold lead and a gold surface since heat and pressure is transmitted through a compliant or deformable media. The use of ...

  7. Wafer bond characterization - Wikipedia

    en.wikipedia.org/wiki/Wafer_bond_characterization

    Wafer bond characterization refers to the process of evaluating the quality and strength of a bond between two semiconductor wafers. The wafer bond characterization is based on different methods and tests. Considered a high importance of the wafer are the successful bonded wafers without flaws.

  8. What is a bond ladder strategy? - AOL

    www.aol.com/finance/bond-ladder-strategy...

    The impact of bond ratings on a bond ladder strategy Bond ratings significantly impact a bond ladder strategy. Higher-rated bonds are generally preferred as they offer a more reliable stream of ...

  9. Porter's four corners model - Wikipedia

    en.wikipedia.org/wiki/Porter's_Four_Corners_Model

    Porter's four corners model is a predictive tool designed by Michael Porter that helps in determining a competitor's course of action. Unlike other predictive models which predominantly rely on a firm's current strategy and capabilities to determine future strategy, Porter's model additionally calls for an understanding of what motivates the competitor.