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PVD process flow diagram. Physical vapor deposition (PVD), sometimes called physical vapor transport (PVT), describes a variety of vacuum deposition methods which can be used to produce thin films and coatings on substrates including metals, ceramics, glass, and polymers. PVD is characterized by a process in which the material transitions from ...
Sputter deposition is a physical vapor deposition (PVD) method of thin film deposition by the phenomenon of sputtering. This involves ejecting material from a "target" that is a source onto a "substrate" such as a silicon wafer. Resputtering is re-emission of the deposited material during the deposition process by ion or atom bombardment. [1] [2]
The PVD process can be carried out at lower deposition temperatures and without corrosive products, but deposition rates are typically lower. Electron-beam physical vapor deposition, however, yields a high deposition rate from 0.1 to 100 μm/min at relatively low substrate temperatures, with very high material utilization efficiency. The ...
Titanium nitride (TiN; sometimes known as tinite) is an extremely hard ceramic material, often used as a physical vapor deposition (PVD) coating on titanium alloys, steel, carbide, and aluminium components to improve the substrate's surface properties.
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In early 2008, TrueScale made its entrance into the diecast model car market when it began producing its own line of 1:18 scale replicas, beginning with the 1980 Porsche 935 K3 Le Mans Apple Computer car. With opening doors, and a removable hood and tail section revealing a highly detailed engine, they had debuted what Sports Car Digest called ...
Evaporation deposition was first observed in incandescent light bulbs during the late nineteenth century. The problem of bulb blackening was one of the main obstacles to making bulbs with long life, and received a great amount of study by Thomas Edison and his General Electric company, as well as many others working on their own lightbulbs.
Ion plating (IP) is a physical vapor deposition (PVD) process that is sometimes called ion assisted deposition (IAD) or ion vapor deposition (IVD) and is a modified version of vacuum deposition. Ion plating uses concurrent or periodic bombardment of the substrate, and deposits film by atomic-sized energetic particles called ions.
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