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  2. Multi-level cell - Wikipedia

    en.wikipedia.org/wiki/Multi-level_cell

    In 2013, Samsung introduced V-NAND (Vertical NAND, also known as 3D NAND) with triple-level cells, which had a memory capacity of 128 Gbit. [27] They expanded their TLC V-NAND technology to 256 Gbit memory in 2015, [24] and 512 Gbit in 2017. [28] Enterprise TLC (eTLC) is a more expensive variant of TLC that is optimized for commercial use.

  3. Charge trap flash - Wikipedia

    en.wikipedia.org/wiki/Charge_trap_flash

    Toshiba in 2007 [24] and Samsung in 2009 [25] announced the development of 3D V-NAND, a means of building a standard NAND flash bit string vertically rather than horizontally to increase the number of bits in a given area of silicon. Figure 6. Vertical NAND structure. A rough idea of the cross section of this is shown in figure 6.

  4. Flash memory - Wikipedia

    en.wikipedia.org/wiki/Flash_memory

    In July 2016, Samsung announced the 4 TB [clarification needed] Samsung 850 EVO which utilizes their 256 Gbit 48-layer TLC 3D V-NAND. [183] In August 2016, Samsung announced a 32 TB 2.5-inch SAS SSD based on their 512 Gbit 64-layer TLC 3D V-NAND. Further, Samsung expects to unveil SSDs with up to 100 TB of storage by 2020. [184]

  5. Polarized 3D system - Wikipedia

    en.wikipedia.org/wiki/Polarized_3D_system

    A polarized 3D system uses polarization glasses to create the illusion of three-dimensional images by restricting the light that reaches each eye (an example of stereoscopy). To present stereoscopic images and films, two images are projected superimposed onto the same screen or display through different polarizing filters .

  6. 3D memory - Wikipedia

    en.wikipedia.org/wiki/3D_memory

    V-NAND (3D NAND) flash memory; 3D integrated circuit (3D IC) memory chips This page was last edited on 19 July 2019, at 21:32 (UTC). Text is available under the ...

  7. Universal Flash Storage - Wikipedia

    en.wikipedia.org/wiki/Universal_Flash_Storage

    UFS uses NAND flash. It may use multiple stacked 3D TLC NAND flash dies (integrated circuits) with an integrated controller. [4] The proposed flash memory specification is supported by consumer electronics companies such as Nokia, Sony Ericsson, Texas Instruments, STMicroelectronics, Samsung, Micron, and SK Hynix. [5]

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