Ads
related to: thickness in plating bath floor sinkarielbath.com has been visited by 10K+ users in the past month
- Vanity Set
Vanity set to suit your needs
Perfect vanities for any styles
- Double Sink Vanities
Perfect vanities for shared space.
Vanity for styles and functionality
- Explore Bathroom Vanities
Luxury vanities for modern bathroom
Upgrade your bathroom décor today!
- Functional Vanity Designs
Stylish vanity with ample storage
Soft closing doors and drawers
- Vanity Set
Search results
Results from the WOW.Com Content Network
The cathode efficiency depends on the process and varies between 90 and 97%. Due to this mismatch, during the plating the nickel concentration in the solution and the pH will slowly rise. [6] The process takes minutes to hours depending on the current density and the intended thickness of the plating. [7]
Electroless nickel immersion gold (ENIG or ENi/IAu), also known as immersion gold (Au), chemical Ni/Au or soft gold, is a metal plating process used in the manufacture of printed circuit boards (PCBs), to avoid oxidation and improve the solderability of copper contacts and plated through-holes.
It is filled with a sample of the plating solution and an appropriate anode which is connected to a rectifier. The "work" is replaced with a Hull cell test panel that will be plated to show the "health" of the bath. The Hull cell is a trapezoidal container that holds 267 milliliters of a plating bath solution.
High zinc improves the bath's efficiency (plating speed), while lower levels improve the bath's ability to throw into low current densities. Typically, the Zn metal level varies between 20 and 50 g/L (2.7-6.7 oz/gal). The pH varies between 4.8 and 5.8 units. The following chart illustrates a typical all potassium chloride bath composition:
The main ingredients of an electroless nickel plating bath are source of nickel cations Ni 2+, usually nickel sulfate and a suitable reducing agent, such as hypophosphite H 2 PO − 2 or borohydride BH − 4. [1] With hypophosphite, the main reaction that produces the nickel plating yields orthophosphite H 2 PO − 3, elemental phosphorus ...
Immersion zinc plating is an electroless (non-electrolytic) coating process that deposits a thin layer of zinc on a less electronegative metal, by immersion in a solution containing a zinc or zincate ions, Zn(OH) 2− 4. A typical use is plating aluminum with zinc prior to electrolytic or electroless nickel plating.
A sulfate-based bath that uses insoluble catalytic anodes, which maintains an electrode potential that prevents oxidation. The trivalent chromium-plating process can plate the workpieces at a similar temperature, rate and hardness, as compared to hexavalent chromium. Plating thickness ranges from 5 to 50 μin (0.13 to 1.27 μm). [2]
Electroless nickel-boron plating developed as a variant of the similar nickel-phosphorus process, discovered accidentally by Charles Adolphe Wurtz in 1844. [2]In 1969, Harold Edward Bellis from DuPont filed a patent for a general class of electroless plating processes using sodium borohydride, dimethylamine borane, or sodium hypophosphite, in the presence of thallium salts, thus producing a ...
Ads
related to: thickness in plating bath floor sinkarielbath.com has been visited by 10K+ users in the past month