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  2. Glass-to-metal seal - Wikipedia

    en.wikipedia.org/wiki/Glass-to-metal_seal

    Uranium glass used as lead-in seals in a vacuum capacitor. Glass-to-metal seals are a type of mechanical seal which joins glass and metal surfaces. They are very important elements in the construction of vacuum tubes, electric discharge tubes, incandescent light bulbs, glass-encapsulated semiconductor diodes, reed switches, glass windows in metal cases, and metal or ceramic packages of ...

  3. Solder - Wikipedia

    en.wikipedia.org/wiki/Solder

    The gold-tin intermetallics layer is responsible for poor mechanical reliability of tin-soldered gold-plated surfaces where the gold plating did not completely dissolve in the solder. Two processes play a role in a solder joint formation: interaction between the substrate and molten solder, and solid-state growth of intermetallic compounds.

  4. Electroless nickel immersion gold - Wikipedia

    en.wikipedia.org/wiki/Electroless_nickel...

    Electroless nickel immersion gold (ENIG or ENi/IAu), also known as immersion gold (Au), chemical Ni/Au or soft gold, is a metal plating process used in the manufacture of printed circuit boards (PCBs), to avoid oxidation and improve the solderability of copper contacts and plated through-holes.

  5. Printed circuit board - Wikipedia

    en.wikipedia.org/wiki/Printed_circuit_board

    Edge connectors, placed along one edge of some boards, are often nickel-plated then gold-plated using ENIG. Another coating consideration is rapid diffusion of coating metal into tin solder. Tin forms intermetallics such as Cu 6 Sn 5 and Ag 3 Cu that dissolve into the Tin liquidus or solidus (at 50 °C), stripping surface coating or leaving voids.

  6. Tinning - Wikipedia

    en.wikipedia.org/wiki/Tinning

    Hot tin-dipping is the process of immersing a part into a bath of pure molten tin at a temperature greater than 450 °F or 232 °C. Tinplate made via hot-dipped tin plating is made by cold rolling steel or iron, pickling to remove any scale, annealing to remove any strain hardening, and then coating it with a thin layer of tin.

  7. Surface-mount technology - Wikipedia

    en.wikipedia.org/wiki/Surface-mount_technology

    Where components are to be placed, the printed circuit board normally has flat, usually tin-lead, silver, or gold plated copper pads without holes, called solder pads. Solder paste, a sticky mixture of flux and tiny solder particles, is first applied to all the solder pads with a stainless steel or nickel stencil using a screen printing process.

  8. Electrical connector - Wikipedia

    en.wikipedia.org/wiki/Electrical_connector

    Contact carriers that hold the parts of a connector together are usually made of plastic, due to its insulating properties. Housings or backshells can be made of molded plastic and metal. [7]: 15 Connector bodies for high-temperature use, such as thermocouples or associated with large incandescent lamps, may be made of fired ceramic material.

  9. Pin header - Wikipedia

    en.wikipedia.org/wiki/Pin_header

    1×6 pin header (one row) 1×6 female header (one row) A pin header (or simply, header) is a form of electrical connector.A male pin header consists of one or more rows of metal pins molded into a plastic base, often 2.54 mm (0.1 in) apart, though available in many spacings. [1]

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