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  2. Transient liquid phase diffusion bonding - Wikipedia

    en.wikipedia.org/wiki/Transient_liquid_phase...

    Transient liquid phase diffusion bonding (TLPDB) is a joining process that has been applied for bonding many metallic and ceramic systems which cannot be bonded by conventional fusion welding techniques. The bonding process produces joints with a uniform composition profile, tolerant of surface oxides and geometrical defects.

  3. Liquid phase sintering - Wikipedia

    en.wikipedia.org/wiki/Liquid_phase_sintering

    Liquid phase sintering is a sintering technique that uses a liquid phase to accelerate the interparticle bonding of the solid phase. In addition to rapid initial particle rearrangement due to capillary forces, mass transport through liquid is generally orders of magnitude faster than through solid, enhancing the diffusional mechanisms that drive densification. [1]

  4. Template:Table of phase transitions - Wikipedia

    en.wikipedia.org/wiki/Template:Table_of_phase...

    Template: Table of phase transitions. ... Download QR code; Print/export Download as PDF; Printable version; In other projects

  5. Category:Welding - Wikipedia

    en.wikipedia.org/wiki/Category:Welding

    Download as PDF; Printable version; In other projects ... usually by a fusion process. Subcategories. This category has the following 7 subcategories, out of 7 total ...

  6. Weld quality assurance - Wikipedia

    en.wikipedia.org/wiki/Weld_quality_assurance

    Weld mapping is the process of assigning information to a weld repair or joint to enable easy identification of weld processes, production (welders, their qualifications, date welded), quality (visual inspection, NDT, standards and specifications) and traceability (tracking weld joints and welded castings, the origin of weld materials).

  7. Thermocompression bonding - Wikipedia

    en.wikipedia.org/wiki/Thermocompression_bonding

    The bonding temperature can be lowered using a higher applied pressure and vice versa, considering that high pressure increases the chances of damage to the structural material or the films. [8] The bonding process itself takes place in a vacuum or forming gas environment, e.g. N 2. [10]

  8. Direct bonding - Wikipedia

    en.wikipedia.org/wiki/Direct_bonding

    The procedural steps of the direct bonding process of wafers any surface is divided into wafer preprocessing, pre-bonding at room temperature and; annealing at elevated temperatures. Even though direct bonding as a wafer bonding technique is able to process nearly all materials, silicon is the most established material up to now. Therefore, the ...

  9. Diffusion bonding - Wikipedia

    en.wikipedia.org/wiki/Diffusion_bonding

    Diffusion bonding or diffusion welding is a solid-state welding technique used in metalworking, capable of joining similar and dissimilar metals. It operates on the principle of solid-state diffusion, wherein the atoms of two solid, metallic surfaces intersperse themselves over time.