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IPC is a trade association whose aim is to standardize the assembly and production requirements of electronic equipment and assemblies. IPC is headquartered in Bannockburn, Illinois, United States with additional offices in Washington, D.C. Atlanta, Ga., and Miami, Fla. in the United States, and overseas offices in China, Japan, Thailand, India, Germany, and Belgium.
The methods outlined in the standard are prescribed by JEDEC and IPC to avoid damage—like cracks and delamination—from moisture absorption and exposure to solder reflow temperatures that can result in yield and reliability degradation. The stipulations of J-STD-003B state:
Dye-n-Pry is a useful failure analysis technique to detect cracking or open circuits in BGA solder joints. [2] This has some practical advantages over other destructive techniques, such as cross sectioning, as it can inspect a full ball grid array which may consist of hundreds of solder joints. Cross sectioning, on the other hand, may only be ...
The most common [citation needed] standards for conformal coating are IPC A-610 [9] and IPC-CC-830. [10] These standards list indications of good and bad coverage and describe various failure mechanisms, such as dewetting. Another type of coating called parylene is applied with a vacuum deposition process at ambient temperature. Film coatings ...
Solder pastes are classified based on the particle size by IPC standard J-STD 005. [3] The table below shows the classification type of a paste compared with the mesh size and particle size. [ 4 ] Some suppliers use proprietary particle size descriptions, Henkel/Loctite descriptions are given for comparison.
In informal usage, the term "printed circuit board" most commonly means "printed circuit assembly" (with components). The IPC preferred term for an assembled board is circuit card assembly (CCA), [19] and for an assembled backplane it is backplane assembly. "Card" is another widely used informal term for a "printed circuit assembly".
The Wiring Harness Manufacturer's Association is a trade group for American manufacturers of wiring harnesses, electronic cable assemblies, and cord sets, along with their suppliers and distributors. [1]
The MIL-STD-883 standard establishes uniform methods, controls, and procedures for testing microelectronic devices suitable for use within military and aerospace electronic systems including basic environmental tests to determine resistance to deleterious effects of natural elements and conditions surrounding military and space operations; mechanical and electrical tests; workmanship and ...
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