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IPC is a trade association whose aim is to standardize the assembly and production requirements of electronic equipment and assemblies. IPC is headquartered in Bannockburn, Illinois, United States with additional offices in Washington, D.C. Atlanta, Ga., and Miami, Fla. in the United States, and overseas offices in China, Japan, Thailand, India, Germany, and Belgium.
Hermes is a machine-to-machine communication standard used in the SMT assembly industry. [1]IPC-HERMES-9852. It is a successor to the SMEMA standard, introducing improvements such as: simpler physical wiring (Ethernet), use of popular data transmission formats (TCP/IP and XML), reduced number of barcode scanners (required only once at the beginning of the line), transmission of board data ...
Today portable electronic systems include roughly 2–40 discrete passive devices/integrated circuit or module. [18] This shows that monolithic or module integration is not capable to include all functionality based on passive components in system realisations, and variety of technologies is needed to minimize logistics and system size.
In informal usage, the term "printed circuit board" most commonly means "printed circuit assembly" (with components). The IPC preferred term for an assembled board is circuit card assembly (CCA), [20] and for an assembled backplane it is backplane assembly. "Card" is another widely used informal term for a "printed circuit assembly".
The most common [citation needed] standards for conformal coating are IPC A-610 [9] and IPC-CC-830. [10] These standards list indications of good and bad coverage and describe various failure mechanisms, such as dewetting. Another type of coating called parylene is applied with a vacuum deposition process at ambient temperature. Film coatings ...
A standard-sized 8-pin dual in-line package (DIP) containing a 555 IC. Integrated circuits and certain other electronic components are put into protective packages to allow easy handling and assembly onto printed circuit boards and to protect the devices from damage. A very large number of package types exist.
Solder pastes are classified based on the particle size by IPC standard J-STD 005. [3] The table below shows the classification type of a paste compared with the mesh size and particle size. [ 4 ] Some suppliers use proprietary particle size descriptions, Henkel/Loctite descriptions are given for comparison.
IEC standards cover a vast range of technologies within electrotechnology. The numbers of older IEC standards were converted in 1997 by adding 60000; for example IEC 27 became IEC 60027. IEC standards often have multiple sub-part documents; only the main title for the standard is listed here. IEC 60027 Letter symbols to be used in electrical ...
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