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  2. Spin coating - Wikipedia

    en.wikipedia.org/wiki/Spin_coating

    The substrate is then rotated at speeds up to 10,000 rpm to spread the coating material by centrifugal force. A machine used for spin coating is called a spin coater, or simply spinner. [1] Rotation is continued while the fluid spins off the edges of the substrate, until the desired thickness of the film is achieved.

  3. Nanosphere lithography - Wikipedia

    en.wikipedia.org/wiki/Nanosphere_lithography

    Dip coating is an effective method for applications where a precise control over the particle distribution isn't required. [3] Spin Coating and solvent evaporation methods are capable of producing large areas of particles, but with limited control over the layer homogeneity or thickness. [3]

  4. Chemistry of photolithography - Wikipedia

    en.wikipedia.org/wiki/Chemistry_of_photolithography

    There are four basic parameters that are involved in spin coating: solution viscosity, solid content (density), angular speed, and spin time. [13] A range of thicknesses can be achieved by spin coating. Most commonly the thicknesses range from 1-200 μm. The main properties that affect the thickness of the film are viscosity and spin speed.

  5. Nanoparticle deposition - Wikipedia

    en.wikipedia.org/wiki/Nanoparticle_deposition

    The spin and dip coating methods are simple methods for nanoparticle deposition. [4] They are useful tools especially in creating self-assembled layers and films where the packing density isn't critical.

  6. Sputter deposition - Wikipedia

    en.wikipedia.org/wiki/Sputter_deposition

    Sputter coating in scanning electron microscopy is a sputter deposition process [clarification needed] to cover a specimen with a thin layer of conducting material, typically a metal, such as a gold/palladium (Au/Pd) alloy. A conductive coating is needed to prevent charging of a specimen with an electron beam in conventional SEM mode (high ...

  7. Layer by layer - Wikipedia

    en.wikipedia.org/wiki/Layer_by_layer

    The bilayers and wash steps can be performed in many different ways including dip coating, spin-coating, spray-coating, flow based techniques and electro-magnetic techniques. [1] The preparation method distinctly impacts the properties of the resultant films, allowing various applications to be realized. [ 1 ]

  8. SU-8 photoresist - Wikipedia

    en.wikipedia.org/wiki/SU-8_photoresist

    SU-8 2000 series resists use cyclopentanone for the primary solvent and can be used to create films between 0.5 and 100 μm in thickness. This formulation may offer improved adhesion on some substrates versus the original formulation.

  9. Micro-encapsulation - Wikipedia

    en.wikipedia.org/wiki/Micro-encapsulation

    Usual deposition rates are about 0.5μm/min. Coating thickness ranges 0.2–75 μm (0.0079–2.9528 mils). The coating is uniform, even over sharp projections. Protein microcapsules are biocompatible and biodegradable , and the presence of the protein backbone renders the membrane more resistant and elastic than those obtained by interfacial ...

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