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Reliability of semiconductors is kept high through several methods. Cleanrooms control impurities, process control controls processing, and burn-in (short term operation at extremes) and probe and test reduce escapes. Probe (wafer prober) tests the semiconductor die, prior to packaging, via micro-probes connected to test equipment.
The goal of HALT is to proactively find weaknesses and fix them, thereby increasing product reliability. Because of its accelerated nature, HALT is typically faster and less expensive than traditional testing techniques. HALT is a test technique called test-to-fail, where a product is tested until failure. HALT does not help to determine or ...
High-temperature operating life (HTOL) is a reliability test applied to integrated circuits (ICs) to determine their intrinsic reliability. This test stresses the IC at an elevated temperature, high voltage and dynamic operation for a predefined period of time. The IC is usually monitored under stress and tested at intermediate intervals.
XRay, Optical, and THz image of a packaged IC. [2]Terahertz imaging is an emerging and significant nondestructive evaluation (NDE) technique used for dielectric (nonconducting, i.e., an insulator) materials analysis and quality control in the pharmaceutical, biomedical, security, materials characterization, and aerospace industries.
The highly accelerated stress test (HAST) method was first proposed by Jeffrey E. Gunn, Sushil K. Malik, and Purabi M. Mazumdar of IBM. [ 1 ] The acceleration factor for elevated humidity is empirically derived to be
Semiconductor characterization techniques are used to characterize a semiconductor material or device (p–n junction, Schottky diode, solar cell, etc.).Some examples of semiconductor properties that could be characterized include the depletion width, carrier concentration, carrier generation and recombination rates, carrier lifetimes, defect concentration, and trap states.
Cole, E. I; Tangyunyong, P; Barton, D.L (1998), "Backside Localization of Open and Shorted IC Interconnections", 36th Annual International Reliability Physics Symposium, The Electron Device Society and the Reliability Society of the Institute of Electrical and Electronics Engineers, Inc.: 129– 136, ISBN 0-7803-4400-6.
In semiconductor devices, problems in the device package may cause failures due to contamination, mechanical stress of the device, or open or short circuits. Failures most commonly occur near the beginning and near the ending of the lifetime of the parts, resulting in the bathtub curve graph of failure rates .