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2. TO-220 - Wikipedia

   en.wikipedia.org/wiki/TO-220

   The TO-220 package is a "power package" intended for power semiconductors and an example of a through-hole design rather than a surface-mount technology type of package. TO-220 packages can be mounted to a heat sink to dissipate several watts of waste heat. On a so-called "infinite heat sink", this can be 50 W or more.

3. File:TO-220-3 Horizontal TabDown.wrl.stl - Wikipedia

   en.wikipedia.org/wiki/File:TO-220-3_Horizontal...

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4. List of electronic component packaging types - Wikipedia

   en.wikipedia.org/wiki/List_of_electronic...

   Chip-size package (CSP) developed by National Semiconductor [21] COB: Chip on board: Bare die supplied without a package. It is mounted directly to the PCB using bonding wires and covered with a blob of black Epoxy. [22] Also used for LEDs. In LEDs, transparent epoxy or a silicon caulk-like material that may contain a phosphor is poured into a ...

5. File:TO-220F-3 Vertical.wrl.stl - Wikipedia

   en.wikipedia.org/wiki/File:TO-220F-3_Vertical...

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6. File:TO-220-2 Vertical.wrl.stl - Wikipedia

   en.wikipedia.org/wiki/File:TO-220-2_Vertical.wrl.stl

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7. TO-263 - Wikipedia

   en.wikipedia.org/wiki/TO-263

   [1] [2] They are similar to the earlier TO-220-style packages intended for high power dissipation [2] [4] but lack the extended metal tab and mounting hole, while representing a larger version of the TO-252, also known as DPAK, SMT package. As with all SMT packages, the pins on a D2PAK are bent to lie against the PCB surface. The TO-263 can ...

8. Talk:TO-220 - Wikipedia

   en.wikipedia.org/wiki/Talk:TO-220

   While I get that it's just to give an idea of the numbers, "A heatsinked TO-220 package dissipating 1 W of heat will have an internal (junction) temperature typically 2 to 5 °C higher than the package's temperature (due to the thermal resistance between the junction and the metal tab), and the metal tab of the TO-220 package will typically ...

9. File:EUD 2000-220.pdf - Wikipedia

   en.wikipedia.org/wiki/File:EUD_2000-220.pdf

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