Search results
Results from the WOW.Com Content Network
The 65 nm process is an advanced lithographic node used in volume CMOS semiconductor fabrication. Printed linewidths (i.e. transistor gate lengths) can reach as low as 25 nm on a nominally 65 nm process, while the pitch between two lines may be greater than 130 nm.
reengineered P6-based microarchitecture used in Intel Core 2 and Xeon microprocessors, built on a 65 nm process, supporting x86-64 level SSE instruction and macro-op fusion and enhanced micro-op fusion with a wider front end and decoder, larger out-of-order core and renamed register, support loop stream detector and large shadow register file.
The dates in this template should match the reference date given in the associated article. We need to do this because putting references in the template is unreasonable, but any assertion of fact needs to be referenced somewhere. If the date in the article is incorrect, edit the article to use the correct date. Be sure you add references.
Download QR code; Print/export Download as PDF; ... Cell BE 65 nm, same as above but manufactured on a 65 nm process;
The new six-input LUT represented a tradeoff between better handling of increasingly complex combinational functions, at the expense of a reduction in the absolute number of LUTs per device. The Virtex-5 series is a 65 nm design fabricated in 1.0 V, triple-oxide process technology. [22] [23]
The technology used a 32 nm SOI process, two CPU cores per module, and up to four modules, ranging from a quad-core design costing approximately US$130 to a $280 eight-core design. Ambarella Inc. announced the availability of the A7L system-on-a-chip circuit for digital still cameras, providing 1080p60 high-definition video capabilities in ...
Get AOL Mail for FREE! Manage your email like never before with travel, photo & document views. Personalize your inbox with themes & tabs. You've Got Mail!
Tick–tock was a production model adopted in 2007 by chip manufacturer Intel.Under this model, every new process technology was first used to manufacture a die shrink of a proven microarchitecture (tick), followed by a new microarchitecture on the now-proven process (tock).