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Surface-mount technology (SMT), originally called planar mounting, [1] is a method in which the electrical components are mounted directly onto the surface of a printed circuit board (PCB). [2] An electrical component mounted in this manner is referred to as a surface-mount device ( SMD ).
In computer science and mathematical logic, satisfiability modulo theories (SMT) is the problem of determining whether a mathematical formula is satisfiable.It generalizes the Boolean satisfiability problem (SAT) to more complex formulas involving real numbers, integers, and/or various data structures such as lists, arrays, bit vectors, and strings.
In beam-lead technology, the metallized pads that would be used for wire bonding connections in a conventional chip are thickened and extended to allow external connections to the circuit. Assemblies using "bare" chips have additional packaging or filling with epoxy to protect the devices from moisture.
A more recent design variation which allows for higher density connections is the dual row micro lead frame (DRMLF) package. This is an MLF package with two rows of lands for devices requiring up to 164 I/O. Typical applications include hard disk drives, USB controllers, and wireless LAN.
Simultaneous multithreading (SMT) is a technique for improving the overall efficiency of superscalar CPUs with hardware multithreading. SMT permits multiple independent threads of execution to better use the resources provided by modern processor architectures .
The single-aspect focus of a software blueprint means that an optimal description medium can be selected. For example, algorithmic code may be best represented using textual code, whereas a graphical user interface may be best represented using a form design. Selection of an intuitive description medium, i.e., one that matches well with mental ...
The iPhone 7 was rumored to use fan-out wafer-level packaging technology in order to achieve a thinner and lighter model. [ 2 ] [ 3 ] [ needs update ] Wafer-level chip scale packaging (WL-CSP) is the smallest package currently available on the market and is produced by OSAT (Outsourced Semiconductor Assembly and Test) companies, such as ...
POWER9, 64-bit, PowerNV 24 cores of 4 way SMT/core, PowerVM 12 cores of 8 way SMT/core, follows the Power ISA 3.0. Introduced in 2016. Introduced in 2016. Power10 , 64-bit, 15 SMT8 or 30 SMT4 cores, will follow the Power ISA 3.1.