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2. Ball grid array - Wikipedia

   en.wikipedia.org/wiki/Ball_grid_array

   A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors . A BGA can provide more interconnection pins than can be put on a dual in-line or flat package .

3. List of electronic component packaging types - Wikipedia

   en.wikipedia.org/wiki/List_of_electronic...

   Low-profile fine-pitch ball grid array : A square or rectangular array of solder balls on one surface, ball spacing typically 0.8 mm Micro ball grid array ( μBGA ): Ball spacing less than 1 mm Thin fine-pitch ball grid array ( TFBGA ): A square or rectangular array of solder balls on one surface, ball spacing typically 0.5 mm

4. Dye-and-pry - Wikipedia

   en.wikipedia.org/wiki/Dye-and-Pry

   Dye-n-Pry is a useful failure analysis technique to detect cracking or open circuits in BGA solder joints. [2] This has some practical advantages over other destructive techniques, such as cross sectioning, as it can inspect a full ball grid array which may consist of hundreds of solder joints. Cross sectioning, on the other hand, may only be ...

5. Rework (electronics) - Wikipedia

   en.wikipedia.org/wiki/Rework_(electronics)

   Reballing involves dismantling, heating the chip until it can be removed from the board, typically with a hot-air gun and vacuum pickup tool, removing the device, removing solder remaining on the device and board, putting new solder balls in place, replacing the original device if there was a poor connection, or using a new one, and heating the ...

6. Solder ball - Wikipedia

   en.wikipedia.org/wiki/Solder_ball

   The solder balls can be placed manually or by automated equipment, and are held in place with a tacky flux. [2] A coined solder ball is a solder ball subject to coining, i.e., flattening to a shape resembling that of a coin, to increase contact reliability. [3] The ball grid array, chip-scale package, and flip chip packages generally use solder ...

7. Solder paste - Wikipedia

   en.wikipedia.org/wiki/Solder_paste

   Solder paste is used in the manufacture of printed circuit boards to connect surface mount components to pads on the board. It is also possible to solder through-hole pin in paste components by printing solder paste in and over the holes. The sticky paste temporarily holds components in place; the board is then heated, melting the paste and ...