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Anodizing increases resistance to corrosion and wear, and provides better adhesion for paint primers and glues than bare metal does. Anodic films can also be used for several cosmetic effects, either with thick porous coatings that can absorb dyes or with thin transparent coatings that add reflected light wave interference effects.
Anodic bonding is commonly used to seal glass to silicon wafers in electronics and microfluidics. Anodic bonding, also known as field assisted bonding or electrostatic sealing, [1] is mostly used for connecting silicon/glass and metal/glass through electric fields. The requirements for anodic bonding are clean and even wafer surfaces and atomic ...
There are three major requirements of creating a desirable surface for adhesive bonding of plastics: the weak boundary layer of the given material must be removed or chemically modified to create a strong boundary layer; the surface energy of the adherend should be higher than the surface energy of the adhesive for good wetting; and the surface profile can be improved to provide mechanical ...
[9] [10] [11] The electronic properties of this semiconducting oxide film also provide a mechanistic explanation of corrosion mediated by chloride, which creates surface states at the oxide surface that lead to electronic breakthrough, restoration of anodic currents, and disruption of the electronic passivation mechanism ("transpassivation"). [12]
Adhesives are typically organized by the method of adhesion followed by reactive or non-reactive, a term which refers to whether the adhesive chemically reacts in order to harden. Alternatively, they can be organized either by their starting physical phase or whether their raw stock is of natural or synthetic origin.
The cohesive and adhesive properties of the adhesive in combination with the substrate determine the properties of a bond. While the adhesion properties substantially determine whether an adhesive adheres to a particular substrate, the cohesive property contributes greatly to the mechanical properties of the bond, particularly the load-bearing ...
Direct bonding, or fusion bonding, is a wafer bonding process without any additional intermediate layers. It is based on chemical bonds between two surfaces of any material possible meeting numerous requirements. [1]
Resorcinol glue, also known as resorcinol-formaldehyde, is an adhesive combination of resin and hardener that withstands long-term water immersion and has high resistance to ultraviolet light. [1] [2] The adhesive, introduced in 1943, has been popular in aircraft and boat construction. [2]