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A ceramic multi-chip module containing four POWER5 processor dies (center) and four 36 MB L3 cache dies (periphery). A multi-chip module (MCM) is generically an electronic assembly (such as a package with a number of conductor terminals or "pins") where multiple integrated circuits (ICs or "chips"), semiconductor dies and/or other discrete components are integrated, usually onto a unifying ...
Multiple chiplets working together in a single integrated circuit may be called a multi-chip module, hybrid IC, 2.5D IC, or an advanced package. Chiplets may be connected with standards such as UCIe, bunch of wires (BoW), AIB, OpenHBI, and OIF XSR. [8] [9] Chiplets not designed by the same company must be designed with interoperability in mind ...
The Optical Internetworking Forum in 2016 published the CFP2-ACO or CFP2 - Analog Coherent Optics Module Interoperability Agreement (IA). This IA supports a configuration where the digital signal processor (DSP) is on the main board and analog optical components are on the module. This IA is useful in the case when the DSP exceeds the module ...
eSCM, entry single chip module – 3.0-3.9 GHz, up to 8 SMT8 cores. It combines two Power10 chips. The first chip is fully functional with 4-8 active cores. The other chip only uses the PCIe functionality acting as a IO switch with plenty of more PCIe lanes. These eSCM modules can be clustered up to four sockets. Module size: 74.5×85.75 mm.
COM-HPC is a computer-on-module form factor standard that targets high performance compute and high I/O levels. Each COM-HPC module integrates core CPU and memory functionality and input and output including USB up to Gen 4, audio (MIPI SoundWire, I2S and DMIC), graphics, (PCI Express) up to Gen. 5, and Ethernet up to 25 Gbit/s per lane. All I ...
Monolithic System Technology (MST) increased packaging density and circuit performance by replacing discrete transistors and diodes with one to four monolithic integrated circuits (resistors now external from the package on the module). Each MST chip holds about five circuits and is the approximate equivalent of an SLT card.
Wi-Fi microcontroller chips: Manufacturer Product name Protocols Processor Flash memory RAM memory ... module: ATSAMW25: Nufront: NL6621: IEEE 802.11b/g/n: ARM Cortex ...
The zEC12 microprocessor (zEnterprise EC12 or just z12) is a chip made by IBM for their zEnterprise EC12 and zEnterprise BC12 mainframe computers, announced on August 28, 2012. It is manufactured at the East Fishkill, New York fabrication plant (previously owned by IBM but production will continue for ten years by new owner GlobalFoundries ).
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