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A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors . A BGA can provide more interconnection pins that can be put on a dual in-line or flat package .
Fine-pitch ball-grid array: A square or rectangular array of solder balls on one surface [3] LBGA: Low-profile ball-grid array: Also known as laminate ball-grid array [3] TEPBGA: Thermally-enhanced plastic ball-grid array: CBGA: Ceramic ball-grid array [3] OBGA: Organic ball-grid array [3] TFBGA: Thin fine-pitch ball-grid array [3] PBGA ...
Depending on the environment, a warning, a fatal exception, or unpredictable behavior will occur if the program attempts to access an array element that is outside the range. In some programming languages , such as C , arrays have a fixed lower bound (zero) and will contain data at each position up to the upper bound (so an array with 5 ...
BGA with an interposer between the integrated circuit die to ball grid array Pentium II: example of an interposer in dark yellow, integrated circuit die to ball grid array chip carrier. An interposer is an electrical interface routing between one socket or connection to another. The purpose of an interposer is to spread a connection to a wider ...
A thin small-outline package (TSOP) is a rectangular, thin-bodied component. A Type I TSOP has legs protruding from the width portion of the package. A Type II TSOP has the legs protruding from the length portion of the package. The ICs on DRAM memory modules were usually TSOPs until they were replaced by ball grid array (BGA).
The C language provides basic arithmetic types, such as integer and real number types, and syntax to build array and compound types. Headers for the C standard library , to be used via include directives , contain definitions of support types, that have additional properties, such as providing storage with an exact size, independent of the ...
Embedded wafer level ball grid array (eWLB) is a packaging technology for integrated circuits. The package interconnects are applied on an artificial wafer made of silicon chips and a casting compound. Principle eWLB. eWLB is a further development of the classical wafer level ball grid array technology (WLB or WLP: wafer level package). The ...
Given a function that accepts an array, a range query (,) on an array = [,..,] takes two indices and and returns the result of when applied to the subarray [, …,].For example, for a function that returns the sum of all values in an array, the range query (,) returns the sum of all values in the range [,].