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The codes given in the chart below usually tell the length and width of the components in tenths of millimeters or hundredths of inches. For example, a metric 2520 component is 2.5 mm by 2.0 mm which corresponds roughly to 0.10 inches by 0.08 inches (hence, imperial size is 1008).
Surface-mount technology (SMT), originally called planar mounting, [1] is a method in which the electrical components are mounted directly onto the surface of a printed circuit board (PCB). [2] An electrical component mounted in this manner is referred to as a surface-mount device ( SMD ).
The Thin shrink small outline package has a smaller body and smaller lead pitch than the standard SOIC package. It is also smaller and thinner than a TSOP with the same lead count.
M7 general purpose diode in DO-214AC (SMA) package (surface mount version of 1N4007) [1] DO-214 is a standard that specifies a group of semiconductor packages for surface-mounted diodes . Overview
The following other wikis use this file: Usage on de.wikipedia.org Surface-mounted device; Usage on et.wikipedia.org Pinnaühendusega Tehnoloogia
SOD-123 package. Small Outline Diode (SOD) is a designation for a group of semiconductor packages for surface mounted diodes.The standard includes multiple variants such as SOD-123, SOD-323, SOD-523 and SOD-923. [1]
SOIC-16 A PIC microcontroller (wide SOIC-28) in a ZIF socket. A small outline integrated circuit (SOIC) is a surface-mounted integrated circuit (IC) package which occupies an area about 30–50% less than an equivalent dual in-line package (DIP), with a typical thickness being 70% less.
To produce a quality solder joint, it's very important for the spheres of metal to be very regular in size and have a low level of oxidation [citation needed]. Solder pastes are classified based on the particle size by IPC standard J-STD 005. [3] The table below shows the classification type of a paste compared with the mesh size and particle ...