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  2. Thermal paste - Wikipedia

    en.wikipedia.org/wiki/Thermal_paste

    Thermal paste is an example of a thermal interface material. As opposed to thermal adhesive, thermal paste does not add mechanical strength to the bond between heat source and heat sink. It has to be coupled with a fastener such as screws to hold the heat sink in place and to apply pressure, spreading and thinning the thermal paste.

  3. Thermal adhesive - Wikipedia

    en.wikipedia.org/wiki/Thermal_adhesive

    Thermal adhesive is a type of thermally conductive glue used for electronic components and heat sinks. It can be available as a paste (similar to thermal paste) or as a double-sided tape. [1] It is commonly used to bond integrated circuits to heatsinks where there are no other mounting mechanisms available.

  4. Thermal relief - Wikipedia

    en.wikipedia.org/wiki/Thermal_relief

    Thermal pads can be seen in several locations on this printed circuit board (PCB), in particular, the bottom pad of the three vertical pads in the top left corner. A thermal relief pad, thermal pad or simply thermal, is a printed circuit board (PCB) pad connected to a copper pour using a thermal connection. It looks like a normal pad with ...

  5. AN/PAS-13 - Wikipedia

    en.wikipedia.org/wiki/AN/PAS-13

    The thermal imaging sensor within the sight requires a low temperature to operate, so a cool-down time of less than 2 minutes is required at startup. The AN/PAS-13B comes in two variants, the medium AN/PAS-13B(V)1 and the heavy AN/PAS-13B(V)2. The medium has a smaller telescope attached, resulting in a zoom of 5x compared to the heavy's 10x.

  6. PAS-22 - Wikipedia

    en.wikipedia.org/wiki/PAS-22

    AsiaSat 3, previously known as HGS-1 and then PAS-22, was a geosynchronous communications satellite, which was salvaged from an unusable geosynchronous transfer orbit (GTO) by means of the Moon's gravity.

  7. Solder paste - Wikipedia

    en.wikipedia.org/wiki/Solder_paste

    The sticky paste temporarily holds components in place; the board is then heated, melting the paste and forming a mechanical bond as well as an electrical connection. The paste is applied to the board by jet printing, stencil printing or syringe; then the components are put in place by a pick-and-place machine or by hand.

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  9. Benzoyl peroxide - Wikipedia

    en.wikipedia.org/wiki/Benzoyl_peroxide

    Benzoyl peroxide is a chemical compound (specifically, an organic peroxide) with structural formula (C 6 H 5 −C(=O)O−) 2, often abbreviated as (BzO) 2.In terms of its structure, the molecule can be described as two benzoyl (C 6 H 5 −C(=O)−, Bz) groups connected by a peroxide (−O−O−).

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