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  2. Electrical isolation test - Wikipedia

    en.wikipedia.org/wiki/Electrical_isolation_test

    The test often reveals problems that occurred during assembly, such as defective components, improper component placement, and insulator defects that may cause inadvertent shorting or grounding to chassis, in turn, compromising electrical circuit quality and product safety. [2]

  3. Electrical safety testing - Wikipedia

    en.wikipedia.org/wiki/Electrical_safety_testing

    An insulation resistance test (IR test) measures the electrical resistance of insulation by applying a voltage between two locations, and measuring the resultant current flow. Proper safety precautions must be taken when doing this test, such as exclusion zones, making sure no wires are exposed, and personal protective equipment is worn.

  4. Chassis ground - Wikipedia

    en.wikipedia.org/wiki/Chassis_ground

    A chassis ground is a link between different metallic parts of a machine to ensure an electrical connection between them. [1] Examples include electronic instruments and motor vehicles. Usages

  5. Bent pin analysis - Wikipedia

    en.wikipedia.org/wiki/Bent_Pin_Analysis

    The role “ground” may be ambiguous in systems that isolate different kinds of grounds (typical isolated grounds are analog signal ground, digital signal ground, AC power ground, DC power ground, and chassis ground). If different kinds of ground paths are in separate paths in a connector, the analysis should treat them as separate signals.

  6. IEC 61000-4-2 - Wikipedia

    en.wikipedia.org/wiki/IEC_61000-4-2

    The publication describes requirements, levels and test methods to achieve immunity compliance of an electronic product. The purpose is to create a reproducible ground for product compliance and the standard defines: ranges, levels, test equipment, setups, procedures, calibrations, generator waveforms and general uncertainties.

  7. Device under test - Wikipedia

    en.wikipedia.org/wiki/Device_under_test

    In semiconductor testing, the device under test is a die on a wafer or the resulting packaged part. A connection system is used, connecting the part to automatic or manual test equipment. The test equipment then applies power to the part, supplies stimulus signals, then measures and evaluates the resulting outputs from the device.

  8. 13 Things You Should Never, Ever Carry in Your Wallet - AOL

    www.aol.com/finance/13-things-never-ever-carry...

    5. Excess Cash. Walking around with a fat wallet of cash feels good, but if you lose your wallet, the odds of keeping your green aren’t good. Besides, if you’re out and about and a potential ...

  9. MIL-STD-810 - Wikipedia

    en.wikipedia.org/wiki/MIL-STD-810

    MIL-STD-810 is maintained by a Tri-Service partnership that includes the United States Air Force, Army, and Navy. [2] The U.S. Army Test and Evaluation Command, or ATEC, serves as Lead Standardization Activity / Preparing Activity, and is chartered under the Defense Standardization Program (DSP) with maintaining the functional expertise and serving as the DoD-wide technical focal point for the ...