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A finned air cooled heatsink with fan clipped onto a CPU, with a smaller passive heatsink without fan in the background A 3-fan heatsink mounted on a video card to maximize cooling efficiency of the GPU and surrounding components Commodore 128DCR computer's switch-mode power supply, with a user-installed 60 mm cooling fan.
Zen 4c is a variant of Zen 4 featuring smaller Zen 4 cores with lower clock frequencies, power usage, reduced L3 cache per core, and is intended to fit a greater number of cores in a given space. Zen 4c's smaller cores and higher core counts are designed for heavily multi-threaded workloads such as cloud computing .
In thermodynamics, the thermal efficiency is a dimensionless performance measure of a device that uses thermal energy, such as an internal combustion engine, steam turbine, steam engine, boiler, furnace, refrigerator, ACs etc.
80 Plus (trademarked 80 PLUS) is a voluntary certification program launched in 2004, intended to promote efficient energy use in computer power supply units (PSUs). Certification is acquirable for products that have more than 80% energy efficiency at 20%, 50% and 100% of rated load, and a power factor of 0.9 or greater at 100% load.
The NEC μPD7220 was the first implementation of a personal computer graphics display processor as a single large-scale integration (LSI) integrated circuit chip. This enabled the design of low-cost, high-performance video graphics cards such as those from Number Nine Visual Technology. It became the best-known GPU until the mid-1980s. [9]
It includes a 533 MHz single-core ARM11 CPU and a PowerVR MBX Lite GPU. It was manufactured by Samsung on a 65 nm process. [11] [264] The APL0298 (also S5L8920) is a PoP SoC introduced on June 8, 2009, at the launch of the iPhone 3GS. It includes a 600 MHz single-core Cortex-A8 CPU and a PowerVR SGX535 GPU. It was manufactured by Samsung on a ...
The laptop has an unusual 3:2 display aspect ratio touch screen featuring what was at its debut the highest pixel density of any laptop, [130] a faster CPU than its predecessors in the Intel Core i5, and an exterior design described by Wired as "an austere rectangular block of aluminum with subtly rounded edges". [131]
Ryzen uses the "Zen" CPU microarchitecture, a redesign that returned AMD to the high-end CPU market after a decade of near-total absence since 2006. [5] AMD's primary competitor, Intel, had largely dominated this market segment starting from the 2006 release of their Core microarchitecture and the Core 2 Duo. [6]
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