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Thermocompression bonding describes a wafer bonding technique and is also referred to as diffusion bonding, pressure joining, thermocompression welding or solid-state welding. Two metals, e.g. gold - gold (Au) , are brought into atomic contact applying force and heat simultaneously. [ 1 ]
Diffusion bonding or diffusion welding is a solid-state welding technique used in metalworking, capable of joining similar and dissimilar metals. It operates on the principle of solid-state diffusion, wherein the atoms of two solid, metallic surfaces intersperse themselves over time.
In chemical physics, atomic diffusion is a diffusion process whereby the random, thermally-activated movement of atoms in a solid results in the net transport of atoms. For example, helium atoms inside a balloon can diffuse through the wall of the balloon and escape, resulting in the balloon slowly deflating.
One application in which Darken’s equations play an instrumental role is in analyzing the process of diffusion bonding. [6] Diffusion bonding is used widely in manufacturing to connect two materials without using adhesives or welding techniques. Diffusion bonding works because atoms from both materials diffuse into the other material ...
The Kirkendall effect is the motion of the interface between two metals that occurs due to the difference in diffusion rates of the metal atoms. The effect can be observed, for example, by placing insoluble markers at the interface between a pure metal and an alloy containing that metal, and heating to a temperature where atomic diffusion is reasonable for the given timescale; the boundary ...
Sintering occurs by diffusion of atoms through the microstructure. This diffusion is caused by a gradient of chemical potential – atoms move from an area of higher chemical potential to an area of lower chemical potential. The different paths the atoms take to get from one spot to another are the "sintering mechanisms" or "matter transport ...
It is based upon the idea that the energy of an atom’s position on a crystal surface is determined by its bonding to neighboring atoms and that transitions simply involve the counting of broken and formed bonds. The TLK model can be applied to surface science topics such as crystal growth, surface diffusion, roughening, and vaporization.
Transient liquid phase diffusion bonding is a process that differs from diffusion bonding. In transient liquid phase diffusion bonding, an element or alloy with a lower melting point in an interlayer diffuses into the lattice and grain boundaries of the substrates at the bonding temperature. Solid state diffusional processes lead to a change of ...