Search results
Results from the WOW.Com Content Network
Hot Form Quench (HFQ) is an aluminum hot stamping process for high strength sheet (typically) 2xxx, 6xxx and 7xxx series alloys, [6] that was initially developed in the early 2000s by Professors Jianguo Lin and Trevor Dean at the University of Birmingham and then at Imperial College London, both in the UK.
For deep draw and complex shapes, and for the avoidance of spring-back, an aluminium hot stamping process (Hot Form Quench) can be used, which forms a blank at a elevated temperature (~ 550 C) in a cooled die, leaving a part in W-temper condition before artificial aging to the T6 full strength state.
6082 aluminium alloy is an alloy in the wrought aluminium-magnesium-silicon family (6000 or 6xxx series). It is one of the more popular alloys in its series (alongside alloys 6005, 6061, and 6063), although it is not strongly featured in ASTM (North American) standards.
7068 alloy is a 7000 series aluminium-zinc alloy registered with the US Aluminium Association and produced to AMS 4331 (chemical composition and mechanical properties) and AMS 2772 (heat treatment). 7068 alloy ‘A’ and ‘B’ tensile data and fatigue properties have been ratified for inclusion in MIL Handbook 5 / MMPDS.
T1 temper 6063 has an ultimate tensile strength of at least 120 MPa (17,000 psi) in thicknesses up to 12.7 mm (0.5 in), and 110 MPa (16,000 psi) from 13 to 25 mm (0.5 to 1 in) thick, and yield strength of at least 62 MPa (9,000 psi) in thickness up to 13 millimetres (0.5 in) and 55 MPa (8,000 psi) from 13 mm (0.5 in) thick.
Unhardened 5086 has a yield strength of 120 MPa (17 ksi) and ultimate tensile strength of 260 MPa (38 ksi) from −28 to 100 °C (−18 to 212 °F). At cryogenic temperatures it is slightly stronger: at −196 °C (−321 °F), yield of 130 MPa (19 ksi) and ultimate tensile strength of 380 MPa (55 ksi); above 100 °C (212 °F) its strength is reduced.
The bonding temperature can be lowered using a higher applied pressure and vice versa, considering that high pressure increases the chances of damage to the structural material or the films. [8] The bonding process itself takes place in a vacuum or forming gas environment, e.g. N 2. [10]
At 500 °C it is still 0.8% Si, at 400 °C 0.3% Si and at 250 °C only 0.05% Si. At room temperature, silicon is practically insoluble. Aluminum cannot be dissolved in silicon at all, not even at high temperatures. Only in the molten state are both completely soluble. Increases in strength due to solid solution strengthening are negligible. [7]