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These are the best air and liquid/AIO CPU coolers for all consumer systems, from small form-factor builds to overclocked big rigs.
To most enthusiasts, Arctic is best known for their Freezer line of CPU coolers as well as their thermal compound called MX-2 and MX-4. [2] The Freezer line of coolers is available in different fan speed, cooling capacity and motherboard compatibility [3] to cater the needs of different type of users from HTPC users to enthusiasts and overclockers.
A finned air cooled heatsink with fan clipped onto a CPU, with a smaller passive heatsink without fan in the background A 3-fan heatsink mounted on a video card to maximize cooling efficiency of the GPU and surrounding components Commodore 128DCR computer's switch-mode power supply, with a user-installed 60 mm cooling fan.
The revealed socket Contacts of the Intel Core 9 Ultra 285K (left; LGA 1851), and i9-14900K (right, Socket 1700). LGA 1851 (codename Socket V1) is a land grid array CPU socket designed by Intel for Meteor Lake-PS and Arrow Lake-S desktop processors, released in October 24, 2024.
Corsair has since expanded their product line to include many types of high-end gaming peripherals, high performance air and water cooling solutions, and other enthusiast-grade components. Around 2009, Corsair contacted CoolIT Systems to integrate their liquid cooling technology into Corsair's offerings which resulted in a long-term partnership.
The company headquarters of Cooler Master is located in Neihu District, Taipei City, Taiwan and has a manufacturing facility in Huizhou, China. [5] To support international operations, the company also has branch offices in various continents, including United States (Fremont, California and Chino, California), the Netherlands (), Italy (), France (), Germany (), Russia (), and Brazil ().
For example, a laptop's CPU cooling system may be designed for a 20 W TDP, which means that it can dissipate up to 20 watts of heat without exceeding the maximum junction temperature for the laptop's CPU. A cooling system can do this using an active cooling method (e.g. conduction coupled with forced convection) such as a heat sink with a fan ...
These systems are replaced with liquid circulation pumps and heat exchanger and/or dry cooler systems. Power use at data centers is often measured in terms of power usage effectiveness (PUE). The definitions of PUE for air-cooled devices and liquid immersion cooled devices are different which makes such direct comparisons inaccurate.
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