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Common features of Ryzen 5000 (Cezanne) desktop CPUs: Socket: AM4. CPUs support DDR4-3200 in dual-channel mode. L1 cache: 64 KB (32 KB data + 32 KB instruction) per core. L2 cache: 512 KB per core. CPUs support 24 PCIe 3.0 lanes. 4 of the lanes are reserved as link to the chipset. No integrated graphics. Fabrication process: TSMC 7FF.
Ryzen 7040 6/8 3800–4300 (5000–5200) 16 MB Socket FP7, FP7r2, FP8 Dual-channel DDR5 or LPDDR5X: February 2023 Dragon Range Ryzen 7045 6/8/12/16
AMD Zen 3+ Family 19h – 2022 revision of Zen 3 used in Ryzen 6000 mobile processors using a 6 nm process. AMD Zen 4 Family 19h – fourth generation Zen architecture, in 5 nm process. [5] Used in Ryzen 7000 consumer processors on the new AM5 platform with DDR5 and PCIe 5.0 support. Adds support for AVX-512 instruction set.
Vermeer Ryzen 5000 series (desktop) Chagall Ryzen Threadripper 5000 series (desktop) Cezanne Ryzen 5000 series (desktop & laptop) Barceló Ryzen 5000 series (laptop) Barceló-R Ryzen 7030 series (laptop) Milan Epyc 7003 series (server) Milan-X Epyc 7003X series (server) Zen 3+ series CPUs and APUs (released 2022) Rembrandt Ryzen 6000 series ...
Ryzen 3 Pro 2200GE: May 10, 2018: Ryzen 3 2200G: 3.5 3.7 65 W Feb 12, 2018: US $99 [81] Ryzen 3 Pro 2200G: May 10, 2018: OEM Ryzen 5 2400GE: 4 (8) 3.2 3.8 RX Vega 11 704:44:16 11 CU 1250 1760 35 W Apr 19, 2018: Ryzen 5 Pro 2400GE: Vega 11 May 10, 2018: Ryzen 5 2400G: 3.6 3.9 RX Vega 11 65 W Feb 12, 2018: US $169 [81] Ryzen 5 Pro 2400G: Vega 11 ...
Common features of Ryzen 5000 desktop APUs: Socket: AM4. All the CPUs support DDR4-3200 in dual-channel mode. L1 cache: 64 KB (32 KB data + 32 KB instruction) per core. L2 cache: 512 KB per core. All the CPUs support 24 PCIe 3.0 lanes. 4 of the lanes are reserved as link to the chipset. Includes integrated GCN 5th generation GPU.
As the first largely "ground up redesign" of the Zen CPU core since the architecture family's original release in early 2017 with Zen 1/Ryzen 1000, Zen 3 was a significant architectural improvement over its predecessors; having a very significant IPC increase of +19% over the prior Zen 2 architecture in addition to being capable of reaching higher clock speeds.
Zen 3 was released on November 5, 2020, [30] using a more matured 7 nm manufacturing process, powering Ryzen 5000 series CPUs and APUs [30] (codename "Vermeer" (CPU) and "Cézanne" (APU)) and Epyc processors (codename "Milan"). Zen 3's main performance gain over Zen 2 is the introduction of a unified CCX, which means that each core chiplet is ...
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