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Socket AM3 is a CPU socket for AMD processors. AM3 was launched on February 9, 2009 as the successor to Socket AM2+ , alongside the initial grouping of Phenom II processors designed for it. [ 1 ] The sole principal change from AM2+ to AM3 is support for DDR3 SDRAM .
AMD-760 chipset AMD-761 Nov 2000 Athlon, Athlon XP, Duron , Alpha 21264. 133 (FSB) AMD-766, VIA-T82C686B AGP 4×, DDR SDRAM AMD-760MP chipset AMD-762 May 2001 Athlon MP: AMD-766 AGP 4× AMD-760MPX chipset AMD-768 AGP 4×, Hardware RNG Most initial boards shipped without USB headers due to a fault with the integrated USB controller.
All the CPUs support 24 PCIe 3.0 lanes. 4 of the lanes are reserved as link to the chipset. No integrated graphics. Fabrication process: TSMC 7FF. Bundled with AMD Wraith Stealth; The AMD 4700S and 4800S desktop processors are part of a "desktop kit" that comes bundled with a motherboard and GDDR6 RAM. The CPU is soldered, and provides 4 PCIe 2 ...
While Socket SP3 doesn't require a chipset, instead utilizing a system-on-a-chip design, Socket sTRX4 and its predecessor require a chipset to provide improved connectivity and functionality. For Socket sTRX4, the TRX40 chipset was developed, which provides a total of 88 PCIe 4.0 lanes, [ 4 ] an increase from the 66 PCIe 3.0 lanes on its ...
The 942 pin count for the AM3+ is an increase of one compared to the AM3 Socket layout. [3] The AM3+ Socket has larger pin socket diameter of 0.51 mm compared to 0.45 mm with the AM3 Socket. There is a faster serial link of 3400 kHz from the CPU to the power controller, compared to 400 kHz.
The new Ryzen AI PRO 300 Series processors deliver industry-leading AI compute 3, with up to three times the AI performance than the previous generation 4, and offer uncompromising performance for everyday workloads. Enabled with AMD PRO Technologies, the Ryzen AI PRO 300 Series processors offer world-class security and manageability features ...
AMD Ultrathin Platform introduced on January 5, 2011, as the fourth AMD mobile platform targeting the ultra-portable notebook market. It features the 40 nm AMD Ontario (a 9-watt AMD APU for netbooks and small form factor desktops and devices) and Zacate (an 18-watt TDP APU for ultrathin, mainstream, and value notebooks as well as desktops and ...
Zen 3 is the name for a CPU microarchitecture by AMD, released on November 5, 2020. [2] [3] It is the successor to Zen 2 and uses TSMC's 7 nm process for the chiplets and GlobalFoundries's 14 nm process for the I/O die on the server chips and 12 nm for desktop chips. [4]