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  2. Structural insulated panel - Wikipedia

    en.wikipedia.org/wiki/Structural_insulated_panel

    SIP systems were used by Woods Constructors of Santa Paula, California, in their homes and apartments from 1965 until 1984. This work was the basis for John Thomas Woods, Paul Flather Woods, John David Woods, and Frederick Thomas Woods when they used a similar concept to patent the Footing Form for Modular homes (US Patent No. 4817353) issued ...

  3. List of SIP software - Wikipedia

    en.wikipedia.org/wiki/List_of_SIP_software

    pfSense, a firewall/router distribution based on FreeBSD and PF; has QoS that properly tags VoIP traffic and a SIP proxy package that is available for NATed endpoints. Its functionality can be expanded with packages like FreeSWITCH, a free/open source software communications platform for making SIP, voice and chat driven products.

  4. Lindal Cedar Homes - Wikipedia

    en.wikipedia.org/wiki/Lindal_Cedar_Homes

    Lindal Cedar Homes (est. in 1944) is an American manufacturer of prefabricated post-and-beam homes. Since 1950s it is the largest North American manufacturer of prefabricated cedar homes. [6] In the 1960s it was the largest US manufacturer of A-frame houses. The company operates as a third-generation, family-owned private company.

  5. List of electronic component packaging types - Wikipedia

    en.wikipedia.org/wiki/List_of_electronic...

    TO-220: Through-hole plastic package with a (usually) metal heat sink tab and three leads; TO-226 [23] TO-247: [24] Plastic-encapsulated package with three leads and a hole for mounting on a heat sink; TO-251: [24] Also called IPAK: SMT package similar to the DPAK but with longer leads for SMT or TH mounting

  6. System in a package - Wikipedia

    en.wikipedia.org/wiki/System_in_a_package

    CAD drawing of a SiP multi-chip which contains a processor, memory and storage on a single substrate. A system in a package (SiP) or system-in-package is a number of integrated circuits (ICs) enclosed in one chip carrier package or encompassing an IC package substrate that may include passive components and perform the functions of an entire system.

  7. Integrated circuit packaging - Wikipedia

    en.wikipedia.org/wiki/Integrated_circuit_packaging

    Recent developments consist of stacking multiple dies in single package called SiP, for System In Package, or three-dimensional integrated circuit. Combining multiple dies on a small substrate, often ceramic, is called an MCM, or Multi-Chip Module. The boundary between a big MCM and a small printed circuit board is sometimes blurry. [11]

  8. Play Backgammon Online for Free - AOL.com

    www.aol.com/games/play/masque-publishing/backgammon

    Play one of the oldest board games in the world...Backgammon on Games.com! Remove all of your pieces from the board before your opponent.

  9. List of mobile virtual network operators in the United States

    en.wikipedia.org/wiki/List_of_mobile_virtual...

    Mobile virtual network operators (MVNOs) in the United States lease wireless telephone and data service from the four major cellular carriers in the country—AT&T Mobility, Boost Mobile, T-Mobile US, and Verizon—and offer various levels of free and/or paid talk, text and data services to their customers.

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