Search results
Results from the WOW.Com Content Network
Computer cooling. A finned air cooled heatsink with fan clipped onto a CPU, with a smaller passive heatsink without fan in the background. A 3-fan heatsink mounted on a video card to maximize cooling efficiency of the GPU and surrounding components. Commodore 128DCR computer's switch-mode power supply, with a user-installed 60 mm cooling fan.
Thermal design power. Heatsink mounted on a motherboard, cooling the CPU underneath it. This heatsink is designed with the cooling capacity matching the CPU’s TDP. The thermal design power (TDP), sometimes called thermal design point, is the maximum amount of heat generated by a computer chip or component (often a CPU, GPU or system on a chip ...
A heat sink (also commonly spelled heatsink,[1]) is a passive heat exchanger that transfers the heat generated by an electronic or a mechanical device to a fluid medium, often air or a liquid coolant, where it is dissipated away from the device, thereby allowing regulation of the device's temperature.
Appearance. Electromigration (red arrow) is due to the momentum transfer from the electrons moving in a wire. Electromigration is the transport of material caused by the gradual movement of the ions in a conductor due to the momentum transfer between conducting electrons and diffusing metal atoms.
kg -1 ⋅m -1 ⋅s 3 ⋅K. Dimension. − −. The thermal conductivity of a material is a measure of its ability to conduct heat. It is commonly denoted by , , or and is measured in W·m −1 ·K −1. Heat transfer occurs at a lower rate in materials of low thermal conductivity than in materials of high thermal conductivity.
The purpose of overclocking is to increase the operating speed of a given component. [3] Normally, on modern systems, the target of overclocking is increasing the performance of a major chip or subsystem, such as the main processor or graphics controller, but other components, such as system memory or system buses (generally on the motherboard), are commonly involved.
Thermal paste is designed to fill imperfections on the surface of a chip. Thermal paste (also called thermal compound, thermal grease, thermal interface material (TIM), thermal gel, heat paste, heat sink compound, heat sink paste or CPU grease) is a thermally conductive (but usually not electrically conductive) chemical compound, which is ...
Underclocking can also be performed on graphics card processor's GPUs, usually with the aim of reducing heat output. For instance, it is possible to set a GPU to run at lower clock rates when performing everyday tasks (e.g. internet browsing and word processing), thus allowing the card to operate at lower temperature and thus lower, quieter fan speeds.