Search results
Results from the WOW.Com Content Network
In 2013, Samsung introduced V-NAND (Vertical NAND, also known as 3D NAND) with triple-level cells, which had a memory capacity of 128 Gbit. [27] They expanded their TLC V-NAND technology to 256 Gbit memory in 2015, [24] and 512 Gbit in 2017. [28] Enterprise TLC (eTLC) is a more expensive variant of TLC that is optimized for commercial use.
2006-09-07 23:27 Jamesm76 294×587×0 (11827 bytes) SVG drawing of a CMOS NAND gate replacing the older PNG version I had previously uploaded ("CMOS NAND Layout.png"). I am the author and I release this to the public domain.
There are several methods for 3D IC design, including recrystallization and wafer bonding methods. There are two major types of wafer bonding, Cu-Cu connections (copper-to-copper connections between stacked ICs, used in TSVs) [18] [19] and through-silicon via (TSV). 3D ICs with TSVs may use solder microbumps, small solder balls as an interface between two individual dies in a 3D IC. [20]
You are free: to share – to copy, distribute and transmit the work; to remix – to adapt the work; Under the following conditions: attribution – You must give appropriate credit, provide a link to the license, and indicate if changes were made. You may do so in any reasonable manner, but not in any way that suggests the licensor endorses ...
The following other wikis use this file: Usage on ar.wikipedia.org منطق ثنائي-ترانزستور; Usage on ca.wikipedia.org Lògica díode-transistor
The following other wikis use this file: Usage on ar.wikipedia.org بوابة اقتران سالبة; Usage on en.wikibooks.org Practical Electronics/IC/4011
dual 4-input NAND gate Schmitt trigger 14 SN74LS18: 74x19 6 hex inverter gate Schmitt trigger 14 SN74LS19: 74x20 2 dual 4-input NAND gate 14 SN74LS20: 74x21 2 dual 4-input AND gate 14 SN74LS21: 74x22 2 dual 4-input NAND gate open-collector 14 SN74LS22: 74x23 2 dual 4-input NOR gate with strobe, one gate expandable with 74x60 16 SN7423: 74x24 4
A gate array is an approach to the design and manufacture of application-specific integrated circuits (ASICs) using a prefabricated chip with components that are later interconnected into logic devices (e.g. NAND gates, flip-flops, etc.) according to custom order by adding metal interconnect layers in the factory. It was popular during the ...