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In 2013, Samsung introduced V-NAND (Vertical NAND, also known as 3D NAND) with triple-level cells, which had a memory capacity of 128 Gbit. [27] They expanded their TLC V-NAND technology to 256 Gbit memory in 2015, [24] and 512 Gbit in 2017. [28] Enterprise TLC (eTLC) is a more expensive variant of TLC that is optimized for commercial use.
There are several methods for 3D IC design, including recrystallization and wafer bonding methods. There are two major types of wafer bonding, Cu-Cu connections (copper-to-copper connections between stacked ICs, used in TSVs) [18] [19] and through-silicon via (TSV). 3D ICs with TSVs may use solder microbumps, small solder balls as an interface between two individual dies in a 3D IC. [20]
All following user names refer to en.wikipedia. 2006-09-07 23:46 Jamesm76 294×587×0 (11839 bytes) I am the author and I release this to the public domain. 2006-09-07 23:27 Jamesm76 294×587×0 (11827 bytes) SVG drawing of a CMOS NAND gate replacing the older PNG version I had previously uploaded ("CMOS NAND Layout.png").
quad 2-input NAND gate driver N O =30 14 SN74LS37: 74x38 4 quad 2-input NAND gate open-collector driver N O =30 14 SN74LS38: 74x39 4 quad 2-input NAND gate (different pinout than 7438) open-collector 60 mA 14 SN7439: 74x40 2 dual 4-input NAND gate driver N O =30 14 SN74LS40: 74x41 1 BCD to decimal decoder / Nixie tube driver open-collector 70 V ...
Ambarella Inc. announced the availability of the A7L system-on-a-chip circuit for digital still cameras, providing 1080p60 high-definition video capabilities in September 2011 [110] Chips using 24–28 nm technology
The following other wikis use this file: Usage on ar.wikipedia.org منطق ثنائي-ترانزستور; Usage on ca.wikipedia.org Lògica díode-transistor
[29] [30] Following the introduction of its 28 nm 7-series FPGAs, Xilinx said that several of the highest-density parts in those FPGA product lines will be constructed using multiple dies in one package, employing technology developed for 3D construction and stacked-die assemblies.
The first part number in the series, the 7400, is a 14-pin IC containing four two-input NAND gates. Each gate uses two input pins and one output pin, with the remaining two pins being power (+5 V) and ground. This part was made in various through-hole and surface-mount packages, including flat pack and plastic/ceramic dual in-line.