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  2. Decapping - Wikipedia

    en.wikipedia.org/wiki/Decapping

    Decapping is usually carried out by chemical etching of the covering, [2] [10] laser cutting, laser evaporation of the covering, [11] plasma etching [10] or mechanical removal of the cover using a milling machine, saw blade, [12] using hot air [13] or by desoldering and cutting. [14] The process can be either destructive or non-destructive of ...

  3. IC extractor - Wikipedia

    en.wikipedia.org/wiki/IC_extractor

    Included are two DIL chips, a plastic holder for the chips, and a IC extractor for the DIL chips. An IC extractor is a tool for safely and quickly removing integrated circuits (ICs) from their sockets. The main purpose of using this tool is to avoid bending the socket pins [1] and to avoid damage through electrostatic discharge (ESD).

  4. Rework (electronics) - Wikipedia

    en.wikipedia.org/wiki/Rework_(electronics)

    Reballing involves dismantling, heating the chip until it can be removed from the board, typically with a hot-air gun and vacuum pickup tool, removing the device, removing solder remaining on the device and board, putting new solder balls in place, replacing the original device if there was a poor connection, or using a new one, and heating the ...

  5. Deep hole drilling - Wikipedia

    en.wikipedia.org/wiki/Deep_hole_drilling

    In addition, the cooling lubricant continuously removes chips from the cutting zone, which makes surface-damaging and time-consuming chip removal strokes unnecessary and therefore improves the quality of the borehole and the productivity of the processes. [1] For the production of deep holes, two different tool types are distinguished.

  6. Die preparation - Wikipedia

    en.wikipedia.org/wiki/Die_preparation

    Wafer glued on blue tape and cut into pieces, with some individual dies removed. Die preparation is a step of semiconductor device fabrication during which a wafer is prepared for IC packaging and IC testing.

  7. Automatic tool changer - Wikipedia

    en.wikipedia.org/wiki/Automatic_Tool_Changer

    ATCs were first used on chip-removal machines, such as mills and lathes. Systems for automatic rearrangement of tools have also been used on sheet metal working machinery. Panel benders have an integrated CNC-controlled device that allows punches to be moved according to the size of the part.

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  9. Chemical-mechanical polishing - Wikipedia

    en.wikipedia.org/wiki/Chemical-mechanical_polishing

    A downward pressure/down force is applied to the carrier, pushing it against the pad; typically the down force is an average force, but local pressure is needed for the removal mechanisms. Down force depends on the contact area which, in turn, is dependent on the structures of both the wafer and the pad.

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