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The Thin shrink small outline package has a smaller body and smaller lead pitch than the standard SOIC package. It is also smaller and thinner than a TSOP with the same lead count. Body widths are 3.0 mm, 4.4 mm and 6.1 mm. The lead counts range from 8 to 80 pins. The lead pitches are 0.5 or 0.65 mm.
Boomi is a software company that specializes in integration platform as a service (iPaaS), API management, master data management and data preparation. [ 3 ] [ 4 ] [ 5 ] Boomi was founded in Berwyn , Pennsylvania , and first launched its services in 2007.
A ceramic multi-chip module containing four POWER5 processor dies (center) and four 36 MB L3 cache dies (periphery). A multi-chip module (MCM) is generically an electronic assembly (such as a package with a number of conductor terminals or "pins") where multiple integrated circuits (ICs or "chips"), semiconductor dies and/or other discrete components are integrated, usually onto a unifying ...
A standard-sized 8-pin dual in-line package (DIP) containing a 555 IC. Integrated circuits and certain other electronic components are put into protective packages to allow easy handling and assembly onto printed circuit boards and to protect the devices from damage. A very large number of package types exist.
For example, think of A as Authors, and B as Books. An Author can write several Books, and a Book can be written by several Authors. In a relational database management system, such relationships are usually implemented by means of an associative table (also known as join table, junction table or cross-reference table), say, AB with two one-to-many relationships A → AB and B → AB.
An (orange-epoxy) encapsulated hybrid circuit on a printed circuit board (PCB).. A hybrid integrated circuit (HIC), hybrid microcircuit, hybrid circuit or simply hybrid is a miniaturized electronic circuit constructed of individual devices, such as semiconductor devices (e.g. transistors, diodes or monolithic ICs) and passive components (e.g. resistors, inductors, transformers, and capacitors ...
The soviet integrated circuit designation is an industrial specification for encoding the names of integrated circuits manufactured in the Soviet Union and the Post-Soviet states. 25 years after the dissolution of the Soviet Union, a number of manufacturers in Russia, Belarus, Ukraine, Latvia, and Uzbekistan still use this designation.
In semiconductor design, standard-cell methodology is a method of designing application-specific integrated circuits (ASICs) with mostly digital-logic features. Standard-cell methodology is an example of design abstraction, whereby a low-level very-large-scale integration layout is encapsulated into an abstract logic representation (such as a NAND gate).