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Chemical milling or industrial etching is the subtractive manufacturing process of using baths of temperature-regulated etching chemicals to remove material to create an object with the desired shape. [1][2] Other names for chemical etching include photo etching, chemical etching, photo chemical etching and photochemical machining.
Etching by Daniel Hopfer, who is believed to have been the first to apply the technique to printmaking. Etching is traditionally the process of using strong acid or mordant to cut into the unprotected parts of a metal surface to create a design in intaglio (incised) in the metal. [1] In modern manufacturing, other chemicals may be used on other ...
Photochemical etching (center), compared to reactive ion etching (bottom) Photochemical machining (PCM), also known as photochemical milling or photo etching, is a chemical milling process used to fabricate sheet metal components using a photoresist and etchants to corrosively machine away selected areas. This process emerged in the 1960s as an ...
Etching is used in microfabrication to chemically remove layers from the surface of a wafer during manufacturing. Etching is a critically important process module in fabrication, and every wafer undergoes many etching steps before it is complete. For many etch steps, part of the wafer is protected from the etchant by a "masking" material which ...
Metal Assisted Chemical Etching (also known as MACE) is the process of wet chemical etching of semiconductors (mainly silicon) with the use of a metal catalyst, usually deposited on the surface of a semiconductor in the form of a thin film or nanoparticles. The semiconductor, covered with the metal is then immersed in an etching solution ...
The two most common types of etching in ceramography are selective chemical corrosion, and a thermal treatment that causes relief. As an example, alumina can be chemically etched by immersion in boiling concentrated phosphoric acid for 30–60 s, or thermally etched in a furnace for 20–40 min at 1,500 °C (2,730 °F) in air.
A plasma etcher, or etching tool, is a tool used in the production of semiconductor devices. A plasma etcher produces a plasma from a process gas, typically oxygen or a fluorine -bearing gas, using a high frequency electric field, typically 13.56 MHz. A silicon wafer is placed in the plasma etcher, and the air is evacuated from the process ...
Physical, chemical, and optical properties of photoresists influence their selection for different processes. [13] The primary properties of the photoresist are resolution capability, process dose and focus latitudes required for curing, and resistance to reactive ion etching.
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