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Micromachining, semiconductor processing, microelectronic fabrication, semiconductor fabrication, MEMS fabrication and integrated circuit technology are terms used instead of microfabrication, but microfabrication is the broad general term.
Die preparation is a step of semiconductor device fabrication during which a wafer is prepared for IC packaging and IC testing. The process of die preparation typically consists of two steps: wafer mounting and wafer dicing .
The other type of packaging used in the 1970s, called the ICP (Integrated Circuit Package), was a ceramic package (sometimes round as the transistor package), with the leads on one side, co-axially with the package axis. Commercial circuit packaging quickly moved to the dual in-line package (DIP), first in ceramic and later in plastic. [5]
A standard-sized 8-pin dual in-line package (DIP) containing a 555 IC.. Integrated circuits and certain other electronic components are put into protective packages to allow easy handling and assembly onto printed circuit boards and to protect the devices from damage.
Electronic packaging is the design and production of enclosures for electronic devices ranging from individual semiconductor devices up to complete systems such as a mainframe computer. Packaging of an electronic system must consider protection from mechanical damage, cooling, radio frequency noise emission and electrostatic discharge .
Packaging challenges often account for 75–95% of the overall costs of MEMS and NEMS. Factors of wafer dicing, device thickness, sequence of final release, thermal expansion, mechanical stress isolation, power and heat dissipation, creep minimization, media isolation, and protective coatings are considered by packaging design to align with the ...
12 nm: Tsuneo Mano, J. Yamada, Junichi Inoue, S. Nakajima Nippon Telegraph and Telephone (NTT) [37] [42] September 1987: 500 nm: 12.5 nm: Hussein I. Hanafi, Robert H. Dennard, Yuan Taur, Nadim F. Haddad IBM T.J. Watson Research Center [43] December 1987: 250 nm? Naoki Kasai, Nobuhiro Endo, Hiroshi Kitajima NEC [44] February 1988: 400 nm 10 nm
Molecular electronics [6] is a technology under development brings hope for future atomic-scale electronic systems. A promising application of molecular electronics was proposed by the IBM researcher Ari Aviram and the theoretical chemist Mark Ratner in their 1974 and 1988 papers Molecules for Memory, Logic and Amplification (see unimolecular ...