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A thermal interface material (shortened to TIM) is any material that is inserted between two components in order to enhance the thermal coupling between them. [1] A common use is heat dissipation, in which the TIM is inserted between a heat-producing device (e.g. an integrated circuit) and a heat-dissipating device (e.g. a heat sink).
The thermally conductive material can vary including metals, metal oxides, silica or ceramic microspheres. The latter are found in products that have much higher dielectric strength, although this comes at the cost of lower thermal conductivity. End-user modding heatsinks may be supplied with thermal adhesive attached (usually a piece of tape).
Thermal paste is an example of a thermal interface material. As opposed to thermal adhesive , thermal paste does not add mechanical strength to the bond between heat source and heat sink. It has to be coupled with a fastener such as screws to hold the heat sink in place and to apply pressure, spreading and thinning the thermal paste.
The gases/fluids filling these gaps may largely influence the total heat flow across the interface. The thermal conductivity of the interstitial material and its pressure, examined through reference to the Knudsen number, are the two properties governing its influence on contact conductance, and thermal transport in heterogeneous materials in ...
Interfacial thermal resistance, also known as thermal boundary resistance, or Kapitza resistance, is a measure of resistance to thermal flow at the interface between two materials. While these terms may be used interchangeably, Kapitza resistance technically refers to an atomically perfect, flat interface whereas thermal boundary resistance is ...
Thicker grades of vinyl siding may, according to some, exhibit more resistance to the most common complaint about vinyl siding – its tendency to crack in very cold weather when it is struck or bumped by a hard object while others feel that a thinner product may allow more 'flex before cracking' and is a subject of debate. However, at "This ...
In computing and electronics, thermal pads (also called thermally conductive pad or thermal interface pad) are pre-formed rectangles of solid material (often paraffin wax or silicone based) commonly found on the underside of heatsinks to aid the conduction of heat away from the component being cooled (such as a CPU or another chip) and into the heatsink (usually made from aluminium or copper).
The core material may be polyethylene (which is combustible), a mineral-based material, or a combination of both. Panels of the same appearance may have different core materials; those with a higher proportion of mineral core withstand fire better, but can still be considered combustible. Fire will be spread by the cladding if the core is ...