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A thermal copper pillar bump, also known as a "thermal bump", is a thermoelectric device made from thin-film thermoelectric material embedded in flip chip interconnects (in particular copper pillar solder bumps) for use in electronics and optoelectronic packaging, including: flip chip packaging of CPU and GPU integrated circuits (chips), laser diodes, and semiconductor optical amplifiers (SOA).
Thermal expansion mismatch between the printed circuit board material and component packaging strains the part-to-board bonds. Thermal cycling may lead to fatigue cracking of the solder joints. Loose particles, like weld flash and tin whiskers , can form in the device cavity and migrate inside the packaging, causing often intermittent and shock ...
The resulting completed flip chip assembly is much smaller than a traditional carrier-based system; the chip sits directly on the circuit board, and is much smaller than the carrier both in area and height. The short wires greatly reduce inductance, allowing higher-speed signals, and also conduct heat better.
A heatsink's thermal mass can be considered as a capacitor (storing heat instead of charge) and the thermal resistance as an electrical resistance (giving a measure of how fast stored heat can be dissipated). Together, these two components form a thermal RC circuit with an associated time constant given by the product of R and C. This quantity ...
Thermal pads can be seen in several locations on this printed circuit board (PCB), in particular, the bottom pad of the three vertical pads in the top left corner. A thermal relief pad, thermal pad or simply thermal, is a printed circuit board (PCB) pad connected to a copper pour using a thermal connection. It looks like a normal pad with ...
A thermal interface material (shortened to TIM) is any material that is inserted between two components in order to enhance the thermal coupling between them. [1] A common use is heat dissipation, in which the TIM is inserted between a heat-producing device (e.g. an integrated circuit) and a heat-dissipating device (e.g. a heat sink).
A cryogenic processor is a device engineered to reduce the temperature of an object to cryogenic levels, typically around −300°F (−184.44°C), at a moderate rate in order to prevent thermal shock to the components being treated.
In integrated circuit packaging, a solder ball, also a solder bump (often referred to simply as "ball" or "bumps") is a ball of solder that provides the contact between the chip package and the printed circuit board, as well as between stacked packages in multichip modules; [1] in the latter case, they may be referred to as microbumps (μbumps ...