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This file contains additional information, probably added from the digital camera or scanner used to create or digitize it. If the file has been modified from its original state, some details may not fully reflect the modified file.
In photolithography, several masks are used in turn, each one reproducing a layer of the completed design, and together known as a mask set. A curvilinear photomask has patterns with curves, which is a departure from conventional photomasks which only have patterns that are completely vertical or horizontal, known as manhattan geometry.
This pattern normally would be an Airy disk resulting from a circular aperture, but with the mask in place, the pattern exhibits asymmetric spikes representing the transform of the mask pattern's spatial frequency and orientation. A very bright star and very dark sky are required to produce highly contrasted spikes that are clearly visible.
An illustration of OPC (Optical Proximity Correction). The blue Γ-like shape is what chip designers would like printed on a wafer, in green is the pattern on a mask after applying optical proximity correction, and the red contour is how the shape actually prints on the wafer (quite close to the desired blue target).
Use of a hardmask involves an additional deposition process, and hence additional cost. First, the hardmask material is deposited and etched into the required pattern using a standard photoresist process. Following that the underlying material can be etched through the hardmask. Finally the hardmask is removed with a further etching process. [2]
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There are several types of contact lithography masks. The standard binary intensity amplitude mask defines dark and light areas where light is blocked or transmitted, respectively. The dark areas are patterned films consisting of chromium or other metal. The light coupling mask has a corrugated dielectric surface. Each protrusion acts as a ...
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