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Dip coating is an industrial coating process which is used, for example, to manufacture bulk products such as coated fabrics and condoms and specialised coatings for example in the biomedical field. Dip coating is also commonly used in academic research, where many chemical and nano material engineering research projects use the dip coating ...
The process is normally automated and requires less human labor than other coating processes. Highly efficient utilization of the coating materials result in lower costs relative to other processes. The aqueous process which is commonly used has less risk of fire relative to the solvent-borne coatings that they have replaced.
Electrostatic coating is a manufacturing process that employs charged particles to more efficiently paint a workpiece. Paint, in the form of either powdered particles or atomized liquid, is initially projected towards a conductive workpiece using normal spraying methods, and is then accelerated toward the work piece by a powerful electrostatic charge.
Dip soldering is used for both through-hole printed circuit assemblies, and surface mount. It is one of the cheapest methods to solder and is extensively used in the small scale industries of developing countries . Dip soldering is the manual equivalent of automated wave soldering. The apparatus required is just a small tank containing molten ...
This work has been released into the public domain by its author, User:LaurensvanLieshout and User:GKFX.This applies worldwide. In some countries this may not be legally possible; if so:
Skinny dual in-line package (SDIP or SPDIP [6]) – Sometimes used to refer to a "narrow" 0.300 in. (or 300 mil) wide DIP, normally when clarification is needed e.g. for DIP with 24 pins or more, which usually come in "wide" 0.600 in wide DIP package. An example of a typical proper full spec for a "narrow" DIP package would be 300 mil body ...
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Conformal coating is a protective, breathable coating of thin polymeric film applied to printed circuit boards (PCBs). Conformal coatings are typically applied with 25–250 μm [ 1 ] thickness on electronic circuitry to protect against moisture and other substances.