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  2. Thermal bridge - Wikipedia

    en.wikipedia.org/wiki/Thermal_bridge

    Temperature distribution in a thermal bridge This thermal image shows a thermal bridging of a high-rise building (Aqua in Chicago). A thermal bridge, also called a cold bridge, heat bridge, or thermal bypass, is an area or component of an object which has higher thermal conductivity than the surrounding materials, [1] creating a path of least resistance for heat transfer. [2]

  3. Reflective surfaces (climate engineering) - Wikipedia

    en.wikipedia.org/wiki/Reflective_surfaces...

    This criterion can also be met by installing a vegetated roof for at least 50% of the roof area, or installing a high albedo and vegetated roof in combination that meets this formula: (Area of Roof meeting Minimum SRI Roof/0.75) + (Area of vegetated roof/0.5) ≥ Total Roof Area. [62]

  4. List of thermal conductivities - Wikipedia

    en.wikipedia.org/wiki/List_of_thermal_conductivities

    American 2016: Flexible insulation from Owens Corning includes faced and unfaced rolls of glass wool and with foil. [91] 1960s values: All thermal conductivities from Cypress to Maple are given across the grain. [92] Hydrogen: 0.1819 [93] 290 Hydrogen gas at room temperature. Ice: 1.6 [23]-2.1 [6]-2.2 [64]-2.22 [94] The Historic Ice Authorities ...

  5. List of physical properties of glass - Wikipedia

    en.wikipedia.org/wiki/List_of_physical...

    Unless stated otherwise, the properties of fused silica (quartz glass) and germania glass are derived from the SciGlass glass database by forming the arithmetic mean of all the experimental values from different authors (in general more than 10 independent sources for quartz glass and T g of germanium oxide glass). The list is not exhaustive.

  6. Thermal conductivity and resistivity - Wikipedia

    en.wikipedia.org/wiki/Thermal_conductivity_and...

    The thermal conductivity of a material is a measure of its ability to conduct heat.It is commonly denoted by , , or and is measured in W·m −1 ·K −1.. Heat transfer occurs at a lower rate in materials of low thermal conductivity than in materials of high thermal conductivity.

  7. Printed circuit board - Wikipedia

    en.wikipedia.org/wiki/Printed_circuit_board

    At the glass transition temperature the resin in the composite softens and significantly increases thermal expansion; exceeding T g then exerts mechanical overload on the board components - e.g. the joints and the vias. Below T g the thermal expansion of the resin roughly matches copper and glass, above it gets significantly higher. As the ...

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