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Placement is an essential step in electronic design automation — the portion of the physical design flow that assigns exact locations for various circuit components within the chip's core area. An inferior placement assignment will not only affect the chip 's performance but might also make it non-manufacturable by producing excessive wire ...
The study of facility location problems (FLP), also known as location analysis, is a branch of operations research and computational geometry concerned with the optimal placement of facilities to minimize transportation costs while considering factors like avoiding placing hazardous materials near housing, and competitors' facilities.
As implied by the name, it is composed of two steps, placement and routing. The first step, placement, involves deciding where to place all electronic components, circuitry, and logic elements in a generally limited amount of space. This is followed by routing, which decides the exact design of all the wires needed to connect the placed components.
Facility location (competitive game) is a problem in game theory: finding an equilbrium in a game in which the players are different producers, each of which looks for a location for placing a facility in order to attract as many consumers as possible.
For example, if the part was shifted 0.25 mm and rotated 10° when picked up, the pickup head will adjust the placement position to place the part in the correct location. Some machines have these optical systems on the robot arm and can carry out the optical calculations without losing time, thereby achieving a lower derating factor.
But location-shifting (grid) has one major advantage over time-shifting (batteries, etc). Batteries might be able to bank enough energy to get an area through the night or a day or two of bad weather.
Component placement is an electronics manufacturing process that places electrical components precisely on printed circuit boards (PCBs) to create electrical interconnections between functional components and the interconnecting circuitry in the PCBs (leads-pads). The component leads must be accurately immersed in the solder paste previously ...
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