enow.com Web Search

Search results

  1. Results from the WOW.Com Content Network
  2. Long charging times remain one of the biggest barriers to EV adoption. It takes about 8 minutes to refuel an internal combustion vehicle at a gas station. Our lithium anode approach will enable ...

  3. Electric vehicle battery - Wikipedia

    en.wikipedia.org/wiki/Electric_vehicle_battery

    When used properly, nickel–metal hydride batteries can have exceptionally long lives, as has been demonstrated in their use in hybrid cars and in the surviving first-generation NiMH Toyota RAV4 EVs that still operate well after 100,000 miles (160,000 km) and over a decade of service. Downsides include finicky charge cycles and poor ...

  4. Diffusion barrier - Wikipedia

    en.wikipedia.org/wiki/Diffusion_barrier

    A barrier metal is a material used in integrated circuits to chemically isolate semiconductors from soft metal interconnects, while maintaining an electrical connection between them. For instance, a layer of barrier metal must surround every copper interconnect in modern integrated circuits, to prevent diffusion of copper into surrounding ...

  5. M. Stanley Whittingham - Wikipedia

    en.wikipedia.org/wiki/M._Stanley_Whittingham

    He also invented the first rechargeable lithium metal battery (LMB), patented in 1977 and assigned to Exxon for commercialization in small devices and electric vehicles. Whittingham's rechargeable lithium metal battery is based on a LiAl anode and an intercalation-type TiS 2 cathode. His work on lithium batteries laid the foundation for others ...

  6. Solid-state battery - Wikipedia

    en.wikipedia.org/wiki/Solid-state_battery

    This is largely due to the use of lithium metal anodes, which have a much higher charge capacity than the graphite anodes used in lithium-ion batteries. At a cell level, lithium-ion energy densities are generally below 300Wh/kg while solid-state battery energy densities are able to exceed 350 Wh/kg. [ 117 ]

  7. Atomic layer deposition - Wikipedia

    en.wikipedia.org/wiki/Atomic_layer_deposition

    Metal barriers are used to encase the copper interconnects used in modern integrated circuits to avoid diffusion of Cu into the surrounding materials, such as insulators and the silicon substrate, and also, to prevent Cu contamination by elements diffusing from the insulators by surrounding every Cu interconnect with a layer of metal barriers ...

  8. Eutectic bonding - Wikipedia

    en.wikipedia.org/wiki/Eutectic_bonding

    The diffusion barrier avoids interaction between Au and Ti/Cr and requires higher temperatures to form a reliable and uniform bond. Further, the very limited solubility of silicon in titanium and chromium can prevent the developing of Au-Si eutectic composition based on the diffusion of silicon through titanium into gold.

  9. AOL Mail

    mail.aol.com

    Get AOL Mail for FREE! Manage your email like never before with travel, photo & document views. Personalize your inbox with themes & tabs. You've Got Mail!