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Gold wire ball-bonded to a gold contact pad. Contact pads or bond pads are small, conductive surface areas of a printed circuit board (PCB) or die of an integrated circuit. They are often made of gold, copper, or aluminum and measure mere micrometres wide. Pads are positioned on the edges of die, to facilitate connections without shorting.
The cross section shows a saw-singulated body with an attached thermal head pad. The lead frame is made of copper alloy and a thermally conductive adhesive is used for attaching the silicon die to the thermal pad. The silicon die is electrically connected to the lead frame by 1–2 thou diameter gold wires. The pads of a saw-singulated package ...
Velostat, also known as Linqstat, is a packaging material made of a polymeric foil (polyolefins) impregnated with carbon black to make it somewhat electrically conductive. It is used for the protection of items or devices that are susceptible to damage from electrostatic discharge. [1] It was developed by Custom Materials, now part of 3M. [2]
Wafer glued on blue tape and cut into pieces, with some individual dies removed. Die preparation is a step of semiconductor device fabrication during which a wafer is prepared for IC packaging and IC testing. The process of die preparation typically consists of two steps: wafer mounting and wafer dicing.
Lead frame for a QFP package, before encapsulation DIP 16 pin Lead frame, after encapsulation and before cutting/separation. The lead frame consists of a central die pad, where the die is placed, surrounded by leads, metal conductors leading away from the die to the outside world. The end of each lead closest to the die ends in a bond pad.
After the dies are tested for functionality and binned, they are packaged. Plastic or ceramic packaging involves mounting the die, connecting the die/bond pads to the pins on the package, and sealing the die. Tiny bondwires are used to connect the pads to the pins. In the 'old days' (1970s), wires were attached by hand, but now specialized ...
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