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A solid with extensive hydrogen bonding will be considered a molecular solid, yet strong hydrogen bonds can have a significant degree of covalent character. As noted above, covalent and ionic bonds form a continuum between shared and transferred electrons; covalent and weak bonds form a continuum between shared and unshared electrons.
The strong bonding of metals in liquid form demonstrates that the energy of a metallic bond is not highly dependent on the direction of the bond; this lack of bond directionality is a direct consequence of electron delocalization, and is best understood in contrast to the directional bonding of covalent bonds.
In physics and chemistry, binding energy is the smallest amount of energy required to remove a particle from a system of particles or to disassemble a system of particles into individual parts. [1] In the former meaning the term is predominantly used in condensed matter physics , atomic physics , and chemistry, whereas in nuclear physics the ...
In chemistry, π backbonding is a π-bonding interaction between a filled (or half filled) orbital of a transition metal atom and a vacant orbital on an adjacent ion or molecule. [ 1 ] [ 2 ] In this type of interaction, electrons from the metal are used to bond to the ligand , which dissipates excess negative charge and stabilizes the metal.
A chemical bonding model is a theoretical model used to explain atomic bonding structure, molecular geometry, properties, and reactivity of physical matter. This can refer to: VSEPR theory, a model of molecular geometry. Valence bond theory, which describes molecular electronic structure with localized bonds and lone pairs.
A chemical bond is the association of atoms or ions to form molecules, crystals, and other structures. The bond may result from the electrostatic force between oppositely charged ions as in ionic bonds or through the sharing of electrons as in covalent bonds, or some combination of these effects.
A sextuple bond is a type of covalent bond involving 12 bonding electrons and in which the bond order is 6. The only known molecules with true sextuple bonds are the diatomic dimolybdenum ( Mo 2 ) and ditungsten ( W 2 ), which exist in the gaseous phase and have boiling points of 4,639 °C (8,382 °F) and 5,930 °C (10,710 °F) respectively.
Direct bonding, or fusion bonding, is a wafer bonding process without any additional intermediate layers. It is based on chemical bonds between two surfaces of any material possible meeting numerous requirements. [1] These requirements are specified for the wafer surface as sufficiently clean, flat and smooth.