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This is a unique-looking barrel connector, apparently intended for providing a DC output jack (most DC jacks are used for power input).. Possibly available in multiple voltage ranges, the one for voltage classification 2 (3.15 to 6.3 V) has an outside diameter of 4.75 mm and a protruding pin of 2.5 mm diameter.
Wafer backgrinding is a semiconductor device fabrication step during which wafer thickness is reduced to allow stacking and high-density packaging of integrated circuits (IC).
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