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Thermal paste is an example of a thermal interface material. As opposed to thermal adhesive, thermal paste does not add mechanical strength to the bond between heat source and heat sink. It has to be coupled with a fastener such as screws to hold the heat sink in place and to apply pressure, spreading and thinning the thermal paste.
There is much debate about the merits of compounds, and overclockers often consider some compounds to be superior to others. The main consideration is to use the minimal amount of thermal compound required to even out surfaces, as the thermal conductivity of compound is typically 1/3 to 1/400 that of metal, though much better than air.
Thermal paste: Mostly used in the electronics industry, thermal pastes provide a very thin bond line and therefore a very small thermal resistance. They have no mechanical strength (other than the surface tension of the paste and the resulting adhesive effect) and require an external mechanical fixation mechanism.
Thermal pastes which are typically used on heat spreaders for CPUs and other chips may require replacement with a different compound in order to avoid the thermal degradation within the dielectric liquid. [5] Depending on the type of application, solder, Indium foil, and thermally conductive epoxies may be used as a replacement materials.
In computing and electronics, thermal pads (also called thermally conductive pad or thermal interface pad) are pre-formed rectangles of solid material (often paraffin wax or silicone based) commonly found on the underside of heatsinks to aid the conduction of heat away from the component being cooled (such as a CPU or another chip) and into the heatsink (usually made from aluminium or copper).
Thermal adhesive is a type of thermally conductive glue used for electronic components and heat sinks. It can be available as a paste (similar to thermal paste) or as a double-sided tape. [1] It is commonly used to bond integrated circuits to heatsinks where there are no other mounting mechanisms available.
Thermal simulations give engineers a visual representation of the temperature and airflow inside the equipment. Thermal simulations enable engineers to design the cooling system; to optimise a design to reduce power consumption, weight and cost; and to verify the thermal design to ensure there are no issues when the equipment is built.
For paste solders, bismuth/ ... and evidence requirements shall be applied for products placed on ... formulations in fabrication thermal shock, solder paste ...
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